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APT10035JLL is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET N-CH 1000V 25A ISOTOP. Review the specifications below when checking this part for your BOM.
The APT10035JLL is a base-mounted N-channel Power MOSFET from the POWER MOS 7 series, manufactured by Microchip Technology. It features an ISOTOP package and supports a drain-source voltage of 1000 V with a continuous drain current of 25 A at case temperature. The device has a maximum power dissipation of 520 W at case temperature and operates within a junction temperature range of -55°C to 150°C. Key electrical parameters include a gate-source voltage limit of ±30 V, a typical on-resistance of 350 mΩ at 14 A and 10 V, and a maximum gate charge of 186 nC at 10 V.
Verify the specific datasheet version and ordering suffixes directly with Microchip Technology or authorized distributors. Confirm that the ISOTOP package dimensions and mounting hole specifications match your mechanical design requirements. Ensure thermal interface materials are compatible with the base-mount configuration for optimal heat dissipation.
Select this component when high voltage isolation and robust thermal handling are required in a compact footprint. The ISOTOP package allows for efficient heat transfer to a heatsink without additional insulators. Consider the 1000 V rating and 25 A current capacity against your system's peak load and voltage stress conditions.
This part belongs to Microchip's POWER MOS 7 family, which utilizes advanced trench gate technology to achieve low on-resistance and fast switching speeds. The ISOTOP package is designed for high-power applications where reliable thermal performance and electrical isolation are critical. It serves as a discrete solution for medium-power conversion tasks.
Check for cross-reference parts with identical 1000 V ratings, similar Rds(on) values, and compatible ISOTOP or miniBLOC footprints. Verify that any substitute maintains the same pinout configuration and thermal characteristics to ensure seamless integration without redesigning the PCB or heatsink assembly.
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