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Product Detailed Parameters
- Description:DIODE MODULE GP 600V 100A ISOTOP
- Series:-
- Mfr:Microchip Technology
- Package:Tube
- Diode Configuration:2 Independent
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):600 V
- Current - Average Rectified (Io) (per Diode):100A
- Voltage - Forward (Vf) (Max) @ If:1.8 V @ 100 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):180 ns
- Current - Reverse Leakage @ Vr:250 µA @ 600 V
- Operating Temperature - Junction:-55°C ~ 175°C
- Mounting Type:Chassis Mount
- Package / Case:SOT-227-4, miniBLOC
- Supplier Device Package:ISOTOP®
- Grade:-
- Qualification:-
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Overview
The APT2X101D60J is a silicon-based Fast Recovery Epitaxial Diode (FRED) module manufactured by Microchip Technology. It features a dual parallel configuration housed in a SOT-227 package with screw mount installation. The device supports a reverse voltage of 600 V and a forward current of 100 A per leg. Key electrical parameters include a forward voltage of 2.2 V, a maximum surge current of 600 A, and a reverse leakage current of 250 uA. Operating temperatures range from -55 C to +175 C.
Feature Summary
- Dual parallel diode configuration for high-current applications
- Fast recovery epitaxial diode technology
- Screw mount chassis mounting style
Applications
- High-power rectification circuits
- Industrial power supplies
- Motor drive systems
Procurement Notes
Verify the specific datasheet version and manufacturer documentation before integration. Confirm that the SOT-227 mechanical dimensions align with the target chassis design. Ensure thermal management solutions meet the requirements for the specified operating temperature range and current load. Check for any recent product lifecycle or obsolescence notices from the manufacturer.
Selection Notes
Select this component when a dual parallel fast recovery diode is required for 600 V applications. The 100 A rating suits moderate to high power density designs. Consider the 2.2 V forward voltage drop for efficiency calculations. The screw mount option provides robust mechanical stability compared to surface mount alternatives.
Part Context
This part belongs to the Microchip APT series of discrete and power modules. It utilizes standard silicon technology within the ISOTOP family of packaging. The module is designed for reliability in demanding electronic environments.
Replacement Considerations
Consult official Microchip documentation for direct cross-references. Verify pinout compatibility and thermal characteristics when substituting similar FRED modules.
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