APT2X21DC120J

APT2X21DC120J

  • Description:DIODE MOD SIC 1200V 20A SOT-227
  • Series:-

SKU:305d747ba382 Category: Brand:

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Product Detailed Parameters

  • Description:DIODE MOD SIC 1200V 20A SOT-227
  • Series:-
  • Mfr:Microsemi Corporation
  • Package:Bulk
  • Diode Configuration:2 Independent
  • Technology:SiC (Silicon Carbide) Schottky
  • Voltage - DC Reverse (Vr) (Max):1200 V
  • Current - Average Rectified (Io) (per Diode):20A
  • Voltage - Forward (Vf) (Max) @ If:1.8 V @ 20 A
  • Speed:No Recovery Time > 500mA (Io)
  • Reverse Recovery Time (trr):0 ns
  • Current - Reverse Leakage @ Vr:400 µA @ 1200 V
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Mounting Type:Chassis Mount
  • Package / Case:ISOTOP
  • Supplier Device Package:SOT-227
  • Grade:-
  • Qualification:-

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APT2X21DC120J

Overview

The APT2X21DC120J is a Silicon Carbide (SiC) Schottky diode module manufactured by Microsemi Corporation. It features an anti-parallel configuration within an ISOTOP SOT-227 package, providing two independent legs with isolated terminals for direct heatsink mounting. The device supports a maximum DC reverse voltage of 1200 V and delivers a maximum average forward current of 20 A per leg at a case temperature of 100°C. Key electrical characteristics include a typical forward voltage of 1.8 V at 20 A and 25°C, rising to 3.0 V at 175°C. The module exhibits zero reverse recovery time and operates reliably across a junction temperature range of -55°C to 175°C.

Feature Summary

  • Utilizes Silicon Carbide Schottky technology to achieve zero reverse recovery and zero forward recovery times.
  • Features positive temperature coefficient on forward voltage for stable parallel operation.
  • Incorporates the ISOTOP SOT-227 package design enabling direct mounting to a heatsink with high isolation voltage.
  • Demonstrates very low stray inductance and low junction-to-case thermal resistance.

Applications

  • Uninterruptible Power Supply (UPS)
  • Induction heating systems
  • Welding equipment
  • High speed rectifiers

Procurement Notes

Verify component authenticity through authorized Microsemi distributors or certified suppliers. Confirm that the specific revision matches the October 2012 datasheet documentation. Ensure handling procedures account for electrostatic discharge sensitivity as outlined in application note APT0502. Validate that the anti-parallel configuration aligns with the intended circuit topology before integration.

Selection Notes

Select this component for applications requiring high-frequency switching with minimal noise and losses. The SiC material offers superior performance compared to silicon alternatives at elevated temperatures. Consider the 20 A current rating and 1200 V blocking capability when designing power stages. The isolated package simplifies thermal management by allowing direct attachment to cooling surfaces without additional insulators.

Part Context

This part belongs to the APT2X21_20DC120J series, which includes both anti-parallel (APT2X21DC120J) and parallel (APT2X20DC120J) configurations. Both variants share identical electrical ratings and physical dimensions but differ in internal terminal connectivity. The series represents Microsemi's ISOTOP line of high-power discrete semiconductor modules designed for robust industrial environments.

Replacement Considerations

The APT2X20DC120J serves as a functional substitute if a parallel diode configuration is acceptable instead of anti-parallel. Verify that the replacement maintains the same SOT-227 footprint and thermal characteristics. No other cross-manufacturer equivalents are confirmed in the provided documentation.

FAQ

What is the difference between the APT2X21DC120J and APT2X20DC120J?

The APT2X21DC120J features an anti-parallel configuration where the cathodes are connected together, while the APT2X20DC120J has a parallel configuration. They share identical electrical specifications and packaging.

Does this device exhibit reverse recovery charge?

No, the APT2X21DC120J is a Silicon Carbide Schottky diode characterized by zero reverse recovery time and zero reverse recovery charge.

How is the device thermally managed?

The ISOTOP package allows direct mounting to a heatsink. The junction-to-case thermal resistance is typically 0.8 °C/W per leg, facilitating efficient heat dissipation.

APT2X21DC120JAPT2X21DC120J

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