APTB1612LVBDSEKJ3C

Overview

The APTB1612LVBDSEKJ3C is a bi-color surface-mount LED from Kingbright's HeliColour series, featuring a compact 1.6x1.2mm package. It integrates separate red and blue light-emitting elements within a single colorless lens structure. The component supports independent operation of each color channel, enabling mixed-color output capabilities. Designed for SMD/SMT mounting, it operates with a maximum continuous forward current of 30 mA per element. The device utilizes a rectangular lens shape to direct illumination efficiently.

Feature Summary

• Integrates separate red and blue emission elements within a unified 1.6x1.2mm surface-mount package
• Features a colorless rectangular lens designed for clear optical transmission
• Supports independent control of individual color channels for mixed-light applications

Applications

• Status indicators requiring multi-state color signaling
• Backlighting systems utilizing combined color outputs
• Compact electronic devices needing small-form-factor optoelectronics

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact wavelength and intensity specifications. Ensure compatibility with moisture-sensitive handling protocols if required by the storage conditions. Confirm that the selected variant matches the intended electrical characteristics for the target circuit design before finalizing procurement orders.

Selection Notes

Select this component when space constraints require a dual-color solution in a minimal footprint. Evaluate the need for independent red and blue control versus single-color alternatives. Consider the mechanical height and thermal management requirements associated with the 1.6x1.2mm SMD form factor during PCB layout planning.

Part Context

This part belongs to Kingbright's HeliColour series, which focuses on high-intensity bi-color LEDs. The series emphasizes compact dimensions suitable for modern consumer electronics. The APTB1612 designation indicates the specific physical size and configuration of the encapsulated semiconductor dies within the leadframe assembly.

Replacement Considerations

Consult the official Kingbright substitution guide for verified equivalents. Cross-reference pinout configurations and luminous intensity ratings to ensure functional parity. Verify that alternative components meet the same mechanical and thermal specifications for direct board replacement.