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Product Detailed Parameters
- Description:DIODE MODULE GP 1200V 470A SP6
- Series:-
- Mfr:Microchip Technology
- Package:Bulk
- Diode Configuration:1 Pair Common Cathode
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):1200 V
- Current - Average Rectified (Io) (per Diode):470A
- Voltage - Forward (Vf) (Max) @ If:3 V @ 400 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):385 ns
- Current - Reverse Leakage @ Vr:250 µA @ 1200 V
- Operating Temperature - Junction:-
- Mounting Type:Chassis Mount
- Package / Case:LP4
- Supplier Device Package:SP6
- Grade:-
- Qualification:-
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Overview
The APTDF400KK120G is a silicon diode module manufactured by Microchip Technology, housed in the D1 package with screw mount installation. It features a common cathode configuration and a maximum reverse voltage of 1.2 kV. The forward voltage is specified at 3.8 V. The component operates within a temperature range from -40 C to +125 C.
Feature Summary
- Common cathode diode configuration for power applications
- Screw mount installation style in D1 package
- Silicon technology construction
Applications
- High voltage power discrete circuits
- Industrial power conversion systems
Procurement Notes
Verify the exact part number against official Microchip Technology documentation to ensure accuracy. Confirm that the D1 package and screw mount specifications match your design requirements. Check for any specific RoHS compliance details or manufacturing change notifications relevant to this component before procurement.
Selection Notes
Select this module when a common cathode arrangement is required for high voltage applications up to 1.2 kV. Ensure the thermal management system supports the operating temperature range of -40 C to +125 C. Verify that the screw mount interface is compatible with your heatsink or chassis design constraints.
Part Context
This component belongs to the Microchip Technology diode module product line. It utilizes silicon technology and is designed for robust performance in demanding electrical environments. The D1 package provides a standardized form factor for integration into various power electronic assemblies requiring reliable rectification capabilities.
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