APTGT150A120T3AG

$98.03

Description：IGBT MODULE 1200V 220A 833W SP3
Series：-

SKU:a3ca60dd434e Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 220A 833W SP3
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 150A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP3
Supplier Device Package：SP3
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：220 A
Power - Max：833 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：10.7 nF @ 25 V

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APTGT150A120T3AG

Overview

The APTGT150A120T3AG is a silicon-based IGBT module manufactured by Microchip Technology, housed in the SP3-32 package. It features a dual configuration with a maximum collector-emitter voltage (VCEO) of 1.2 kV and a continuous collector current of 220 A at 25°C. The saturation voltage is 1.7 V, while power dissipation reaches 833 W. Operating temperatures range from -40°C to +100°C, with a maximum gate-emitter voltage of 20 V. The device utilizes screw mount installation and has a gate-emitter leakage current of 400 nA.

Feature Summary

Dual IGBT configuration within a compact SP3-32 package
High voltage capability suitable for demanding power applications
Robust thermal performance with specified power dissipation ratings

Applications

Industrial motor drives
Uninterruptible power supplies
Switched-mode power supplies

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or direct channels. Confirm RoHS compliance status via official documentation before integration. Ensure storage conditions align with semiconductor handling guidelines to prevent moisture sensitivity damage during assembly processes.

Selection Notes

Select this module for applications requiring 1.2 kV blocking voltage and high current capacity. Evaluate thermal management requirements against the 833 W dissipation rating. Compare electrical characteristics with alternative packages if space constraints differ. Verify gate drive compatibility with the 20 V maximum rating.

Part Context

This component belongs to the Microchip Technology IGBT module family, specifically designed for power electronics. It represents a silicon-based solution offering balanced performance for medium to high-power switching applications. The SP3-32 packaging provides a standardized form factor for industrial mounting solutions.

Replacement Considerations

Consult official Microchip Technology substitution guides for verified alternatives. Cross-reference pinouts and electrical parameters when considering equivalent modules from other manufacturers to ensure functional compatibility.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

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Mode of Transportation

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Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.