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Product Detailed Parameters
- Description：IGBT MODULE 600V 500A 1250W D3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 400A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：D-3 Module
- Supplier Device Package：D3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：500 A
- Power - Max：1250 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：24 nF @ 25 V
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Overview
The APTGT400A60D3G is a single IGBT module manufactured by Microchip Technology, utilizing silicon trench field-stop technology. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 500 A at 25°C. The saturation voltage is specified at 1.5 V, with a power dissipation capacity of 1.25 kW. The device operates within a junction temperature range of -40°C to +125°C and uses the D3-11 screw-mount package.
Feature Summary
- Single configuration trench field-stop IGBT design
- Screw-mount installation in D3-11 package
- High thermal stability up to 125°C
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Inverter circuits
Procurement Notes
Verify component authenticity through authorized Microchip distributors or official manufacturer channels. Confirm RoHS compliance status via the latest datasheet revision. Ensure packaging integrity upon receipt, as modules are supplied in bulk. Cross-reference ordering suffixes to confirm specific pinout and terminal configurations match system requirements before integration.
Selection Notes
Select this module for applications requiring 600 V blocking capability and high current handling up to 500 A. Evaluate thermal management solutions to maintain junction temperatures within the specified operating range. Compare saturation voltage characteristics against alternative single IGBT modules in the D3-11 form factor to optimize conduction losses for the specific duty cycle.
Part Context
This component belongs to the APTGT series of high-power IGBT modules from Microchip Technology. The series utilizes trench field-stop technology to balance switching speed and conduction efficiency. The D3-11 package provides a standardized footprint for industrial power electronics, facilitating compatibility with existing heatsink and mounting infrastructure common in medium-power conversion systems.
Replacement Considerations
Direct substitutes include other single IGBT modules in the D3-11 package with matching 600 V ratings and similar current capacities. Verify pin compatibility and thermal resistance values when considering alternatives from the same product family or competing manufacturers offering equivalent trench field-stop technologies.
