AR1PMHM3/85A

Overview

The AR1PMHM3/85A is a 1000 V, 1 A avalanche rectifier from Vishay’s eSMP® series. It features a DO-220AA (SMP) surface-mount package with dimensions of 3.40 x 2.03 mm and a height of 1.00 mm. Key electrical parameters include a maximum reverse leakage current of 1 µA at 1000 V, a forward voltage drop of 1.6 V, and a reverse recovery time of 120 ns. The device supports an average rectified current of 1 A and operates within a junction temperature range of -55°C to +175°C.

Feature Summary

• Engineered for avalanche energy handling capabilities in high-voltage applications
• Utilizes the compact eSMP® surface-mount technology for efficient PCB space utilization
• Designed for automotive-grade reliability with AEC-Q101 qualification

Applications

• Automotive electronics systems requiring high-voltage rectification
• High-frequency switching power supplies
• Inductive load protection circuits

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm that the ordering suffix /85A corresponds to the specific tape-and-reel packaging configuration required for your assembly line. Ensure compliance with RoHS directives and check for any recent Product Change Notifications (PCNs) regarding manufacturing site updates before finalizing procurement orders.

Selection Notes

Select this component when designing circuits requiring robust avalanche ruggedness combined with fast recovery characteristics. The 1000 V rating suits high-voltage DC link applications, while the 1 A current capacity fits moderate-power scenarios. Consider the DO-220AA footprint constraints and thermal management requirements associated with the 1.6 V forward voltage drop during continuous conduction.

Part Context

This part belongs to Vishay’s eSMP® family of surface-mount rectifiers. It shares the physical SMP (DO-220AA) footprint with other variants like the AR1PDHM3/85A, which offers a lower 200 V rating. The AR1PMHM3/85A specifically targets high-voltage isolation needs within the same compact package family, maintaining consistent mechanical dimensions for board layout flexibility across different voltage tiers.

Replacement Considerations

The AR1FMHM3/H serves as a functional substitute but utilizes the smaller DO-219AB (SMF) package. Designers must verify if the existing PCB land pattern accommodates the different footprint dimensions. Electrical ratings such as voltage and current should be cross-checked against the new component's datasheet specifications.