AS1334-BTDT

Overview

The AS1334 is a high-performance, low-power CMOS image sensor designed for mobile phone cameras and other portable devices. It features a 1/5-inch optical format with a resolution of 2 megapixels (1600x1200). The sensor utilizes a backside illumination (BSI) architecture to enhance light sensitivity and reduce power consumption. Key electrical specifications include a supply voltage range of 1.8V to 2.9V for the core logic and 2.7V to 3.6V for I/O interfaces. It supports various output formats including raw Bayer RGB and compressed JPEG via an integrated ISP.

Feature Summary

• Backside illumination technology for improved low-light performance
• Integrated image signal processor for direct JPEG output
• Low power consumption suitable for battery-operated devices
• Supports multiple video output formats including MIPI CSI-2

Applications

• Mobile phone cameras
• Tablet computers
• Webcams
• Video conferencing systems

Procurement Notes

Verify the specific suffix codes on the component marking against the official datasheet to confirm package type, temperature grade, and RoHS compliance status. Ensure that the ordering information matches the exact revision level required for your design integration. Cross-reference the manufacturer's latest documentation for any updates regarding availability or recommended alternatives.

Selection Notes

Select this component when a compact form factor and high image quality in low-light conditions are prioritized. Consider the integrated ISP capabilities if system-level processing resources are limited. Evaluate the power budget constraints of the target application against the sensor's active and standby current specifications. Confirm interface compatibility with the host processor's camera input ports.

Part Context

This model belongs to the AS13xx series of CMOS image sensors from ams-OSRAM. These sensors are engineered for consumer electronics requiring small footprint and high efficiency. The series typically shares common architectural features such as BSI technology and integrated processing blocks, tailored for different resolution and performance tiers within the mobile imaging market.

Replacement Considerations

Consult the manufacturer's official substitution guide for verified alternative part numbers. Ensure that any replacement maintains compatible pinout, electrical characteristics, and mechanical dimensions. Verify that the substitute component meets the same regulatory certifications and environmental specifications required by the original design.