AS33B2032

Overview

The AS33B2032 is a ferrite clamp-on core manufactured by LeaderTech Inc. It features a square shape and utilizes material grade 33 for EMI suppression. The component includes an adhesive base and a snap mechanism for secure attachment to cables. Key physical dimensions include an internal diameter of 7.4 mm, an external length of 32.1 mm, an external width of 20.1 mm, and an external height of 19.6 mm. The unit weighs approximately 43.676 grams.

Feature Summary

• Snap-fit design with integrated adhesive base for permanent cable mounting
• Square cross-section geometry optimized for specific cable profiles
• Ferrite material composition selected for high-frequency noise attenuation

Applications

• EMI suppression on single signal or power cables
• Noise filtering in electronic enclosures
• Interconnect cable protection in circuit board assemblies

Procurement Notes

Verify the exact material grade and dimensional tolerances against the official LeaderTech datasheet before integration. Confirm that the adhesive backing specification meets the environmental requirements of the target application. Ensure compatibility with the cable outer diameter relative to the specified internal diameter.

Selection Notes

Select this component when a fixed, non-removable ferrite solution is required for cable management. The adhesive base distinguishes it from standard snap-only cores, offering enhanced stability in vibration-prone environments. Evaluate the magnetic permeability of material grade 33 against the specific frequency spectrum of the interference being mitigated.

Part Context

This part belongs to the LeaderTech ferrite clamp-on core product line, designed for passive EMI/RFI shielding. It serves as a specialized variant within the broader category of magnetic suppressors, distinguished by its structural integration of an adhesive layer to facilitate installation on wires without additional hardware.

Replacement Considerations

The AS33B2032 is functionally similar to the SS33B2033, which shares the same material grade and general form factor but lacks the adhesive base feature. Verify if the adhesive requirement is critical for the specific assembly process before substituting.