AS3PKHM3_A/I

Overview

The AS3PKHM3_A/I is a fast recovery rectifier manufactured by Vishay Semiconductors. It features an 800 V reverse voltage rating and a 3 A average forward current capability. The device utilizes the eSMP (SMPC) surface-mount package, specifically TO-277A-3. Key electrical parameters include a maximum forward voltage of 900 mV at rated current and a typical reverse leakage current of 280 nA. It supports a maximum surge current of 70 A and operates within a junction temperature range of -55°C to +175°C. The component is qualified under AEC-Q101 standards for automotive applications.

Feature Summary

• Fast recovery performance with avalanche capability for robust operation in switching circuits
• Automotive-grade qualification ensuring reliability in demanding environments
• Surface-mount design optimized for automated assembly processes

Applications

• Automotive power supply systems
• General-purpose rectification in industrial electronics
• High-frequency switching power converters

Procurement Notes

Verify the specific suffix designation against official Vishay documentation to confirm package and tape-and-reel specifications. Ensure that the ordering information matches the required automotive qualification standards. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status before finalizing procurement orders.

Selection Notes

Select this component when high reverse voltage blocking and fast recovery characteristics are required in a compact surface-mount form factor. The AEC-Q101 qualification makes it suitable for automotive applications requiring high thermal stability. Consider the 800 V rating and 3 A current capacity to ensure adequate headroom for the target circuit's peak operating conditions.

Part Context

This device belongs to the AS3P series of fast recovery rectifiers from Vishay. It is designed to replace through-hole equivalents in modern surface-mount designs. The eSMP packaging provides improved thermal performance and mechanical stability compared to traditional leaded packages, facilitating higher density PCB layouts.