AS4C128M16D3L-12BIN

Memory IC Overview

The AS4C128M16D3L-12BIN is a DDR3L SDRAM component manufactured by Alliance Memory, Inc. It features an 8 Gbit storage capacity organized as 512M x 16 bits with a 16-bit data bus width. The device supports a maximum clock frequency of 800 MHz and has a typical access time of 20 ns. Operating voltage ranges from 1.283 V to 1.45 V. It is housed in a 96-ball FBGA package and operates within a temperature range of -40°C to +95°C.

Memory IC Feature Summary

• Supports low-voltage operation for reduced power consumption
• Provides high-speed data transfer capabilities via synchronous interface
• Features industrial-grade thermal stability for demanding environments

Memory IC Applications

• Industrial control systems
• Automotive electronics
• Communication equipment

Memory IC Procurement Notes

Verify the exact part number against official manufacturer documentation to ensure compatibility with system requirements. Confirm that the specific suffix indicates the correct temperature grade and packaging configuration. Cross-reference technical specifications with design constraints before procurement to avoid integration issues.

Memory IC Selection Notes

Select this component when designing systems requiring robust memory performance under varying thermal conditions. Ensure the host controller supports DDR3L standards and compatible voltage levels. Evaluate the 96-ball FBGA package footprint against PCB layout constraints during the initial design phase.

Memory IC Part Context

This dynamic random-access memory belongs to the DDR3L family, designed for applications needing efficient power usage alongside reliable data retention. The industrial temperature rating distinguishes it from commercial variants, making it suitable for harsh operational environments where standard components might fail.

Memory IC Replacement Considerations

Check for direct substitutes within the same manufacturer's portfolio that share identical pinouts and electrical characteristics. Verify if alternative packages or speed grades offer equivalent functionality without requiring board redesign.