AS4C128M16D3LB-12BINTR

$3.96

Description：IC DRAM 2GBIT PARALLEL 96BGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tape & Reel (TR)

SKU:5f53982162a9 Category: Memory IC Brand: Alliance Memory, Inc.

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Product introduction

AS4C128M16D3LB-12BINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 2GBIT PARALLEL 96BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C128M16D3LB-12BINTR

Description：IC DRAM 2GBIT PARALLEL 96BGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3L
Memory Size：2Gbit
Memory Organization：128M x 16
Memory Interface：Parallel
Clock Frequency：800 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.283V ~ 1.45V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：96-TFBGA
Supplier Device Package：96-BGA (13x9)
Access Time：20 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for AS4C128M16D3LB-12BINTR

AS4C128M16D3LB-12BINTR

Memory IC Overview

The AS4C128M16D3LB-12BINTR is a 2 Gbit (256 M x 8 or 128 M x 16) DDR3L SDRAM manufactured by Alliance Memory. It operates at a maximum clock frequency of 800 MHz with an access time of 20 ns. The device supports a supply voltage range of 1.283 V to 1.45 V and features a 96-ball FBGA package. It is rated for industrial temperature operation from -40°C to +95°C. The component utilizes a synchronous interface and is supplied in tape and reel packaging.

Memory IC Feature Summary

Supports low-voltage operation within the DDR3L specification range
Industrial temperature rating for extended environmental reliability
High-speed synchronous interface supporting up to 800 MHz data rates

Memory IC Applications

Industrial control systems requiring robust memory performance
Embedded computing platforms operating in extreme temperatures
Telecommunications infrastructure equipment

Memory IC Procurement Notes

Verify the specific suffix BINTR indicates tape and reel packaging configuration against official datasheets. Confirm the B die revision matches design requirements. Ensure voltage levels align with system power rails. Check humidity sensitivity classification for storage handling. Validate lead-free status if required by assembly standards.

Memory IC Selection Notes

Select this part for applications demanding high bandwidth in harsh environments. Compare access times and power consumption against alternative DDR3L options. Consider the 96-ball FBGA footprint for PCB layout constraints. Evaluate thermal management needs given the industrial temperature range. Verify compatibility with existing controller interfaces.

Memory IC Part Context

This component belongs to the AS4C512M16D3L series of DDR3L SDRAMs from Alliance Memory. It shares architectural similarities with other members like the AS4C256M16D3LC but differs in density and temperature grade. The series targets high-performance embedded markets requiring reliable data storage.