Memory IC AS4C128M16D3LC-12BINTR product image

AS4C128M16D3LC-12BINTR

$5.84
  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:e50f049bcd5e Category: Brand:

  
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AS4C128M16D3LC-12BINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 2GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C128M16D3LC-12BINTR

  • Description:IC DRAM 2GBIT PARALLEL 96FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-FBGA (7.5x13)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C128M16D3LC-12BINTR

AS4C128M16D3LC-12BINTR

Memory IC Overview

The AS4C128M16D3LC-12BINTR is a DDR3L SDRAM component manufactured by Alliance Memory, Inc. It features a storage capacity of 2 Gbit organized as 128 M x 16 with a data bus width of 16 bits. The maximum clock frequency is 800 MHz, and the access time is 225 ps. Operating voltage ranges from 1.283 V to 1.45 V. The device is housed in a 96-ball FBGA package and supports commercial temperature operation between 0°C and +95°C.

Memory IC Feature Summary

  • Supports low-voltage DDR3L operation for reduced power consumption
  • High-speed synchronous dynamic random access memory architecture
  • Compact surface-mount packaging suitable for space-constrained designs

Memory IC Applications

  • Consumer electronics requiring high-density memory
  • Industrial control systems operating within commercial temperature ranges
  • Embedded computing platforms utilizing DDR3L interfaces

Memory IC Procurement Notes

Verify the specific suffix BINTR against official datasheets to confirm industrial die integration within the commercial package configuration. Ensure compatibility with system voltage rails between 1.283 V and 1.45 V. Confirm moisture sensitivity handling requirements prior to assembly. Cross-reference manufacturer documentation for any recent product change notices affecting this part number.

Memory IC Selection Notes

Select this component when a 2 Gbit DDR3L density is required with a 16-bit interface width. The 800 MHz speed grade suits applications needing moderate bandwidth. Verify that the 96-ball FBGA footprint matches the PCB layout. Ensure the design accommodates the specified commercial temperature range limits.

Memory IC Part Context

This part belongs to the AS4C128M16D3LC series of low-power DDR3 SDRAMs. It shares architectural similarities with other members of the family but differs in temperature rating and internal die specifications indicated by the suffix. The series targets general-purpose memory applications requiring efficient power management.

Memory IC Replacement Considerations

Check for direct pin-compatible alternatives within the same manufacturer's portfolio. Verify electrical parameters such as access time and voltage levels before substituting. Ensure the replacement supports the required 16-bit bus width and 96-ball FBGA package.

AS4C128M16D3LC-12BINTRAS4C128M16D3LC-12BINTR
$5.84
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