Memory IC AS4C128M8D3A-12BINTR product image

AS4C128M8D3A-12BINTR

  • Description:IC DRAM 1GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:fbd28a0b3dc1 Category: Brand:

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AS4C128M8D3A-12BINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 1GBIT PARALLEL 78FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C128M8D3A-12BINTR

  • Description:IC DRAM 1GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-VFBGA
  • Supplier Device Package:78-FBGA (8x10.5)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C128M8D3A-12BINTR

AS4C128M8D3A-12BINTR

Memory IC Overview

The AS4C128M8D3A-12BINTR is a 1 Gbit DDR3 SDRAM manufactured by Alliance Memory. It features an organization of 128M x 8 and operates at a maximum clock frequency of 800 MHz. The device utilizes a 78-ball FBGA package and supports a supply voltage range of 1.425 V to 1.575 V. Access time is specified at 20 ns, with an operating temperature range from -40°C to +95°C for industrial applications. This component is supplied in tape and reel packaging.

Memory IC Feature Summary

  • Supports high-speed data transfer rates up to 800 MHz via the DDR3 interface standard.
  • Designed for industrial environments with extended temperature tolerance capabilities.
  • Utilizes a compact surface-mount 78-ball FBGA package for efficient board space utilization.

Memory IC Applications

  • Industrial control systems requiring volatile memory storage
  • Embedded computing platforms operating in harsh thermal conditions
  • Consumer electronics utilizing DDR3 architecture

Memory IC Procurement Notes

Verify the specific suffix BINTR confirms tape and reel packaging requirements against your assembly line specifications. Ensure the 1.5V nominal voltage aligns with your system power rails. Confirm the industrial temperature grade meets environmental standards. Cross-reference the 78-ball FBGA footprint with your PCB design files prior to ordering.

Memory IC Selection Notes

Select this part when a 1 Gbit density with an 8-bit bus width is required. The 800 MHz speed class suits high-bandwidth applications. Consider the 78-ball FBGA form factor for size constraints. Verify compatibility with existing DDR3 controllers supporting the 1.5V standard and industrial temperature ranges.

Memory IC Part Context

This component belongs to the Alliance Memory AS4C series of synchronous dynamic random-access memories. The series offers various densities and speeds tailored for different market segments. The AS4C128M8D3A variant specifically targets applications needing reliable 1 Gbit storage with standard DDR3 electrical characteristics.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the same manufacturer's portfolio. Verify if newer die revisions offer improved performance or availability. Ensure any replacement maintains the 1.5V operation and industrial temperature rating.

AS4C128M8D3A-12BINTRAS4C128M8D3A-12BINTR

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