ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
AS4C256M8D3LB-12BIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 2GBIT PARALLEL 78FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AS4C256M8D3LB-12BIN
- Description：IC DRAM 2GBIT PARALLEL 78FBGA
- Series：-
- Mfr：Alliance Memory, Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR3L
- Memory Size：2Gbit
- Memory Organization：256M x 8
- Memory Interface：Parallel
- Clock Frequency：800 MHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：1.283V ~ 1.45V
- Operating Temperature：-40°C ~ 95°C (TC)
- Mounting Type：Surface Mount
- Package / Case：78-VFBGA
- Supplier Device Package：78-FBGA (8x10.5)
- Access Time：20 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AS4C256M8D3LB-12BIN
Memory IC Overview
The AS4C256M8D3LB-12BIN is a 2 Gbit DDR3L SDRAM manufactured by Alliance Memory. It features an organization of 256M x 8 and operates at a maximum clock frequency of 800 MHz with a 20 ns access time. The device supports a supply voltage range of 1.283 V to 1.45 V. It is housed in a 78-ball FBGA package (8x10.5 mm) and is rated for an extended industrial temperature range from -40°C to +95°C.
Memory IC Feature Summary
- Supports low-voltage operation within the 1.35V standard range for power efficiency
- Provides high-speed data transfer capabilities up to 800 MHz
- Engineered for reliable performance across extended industrial temperature environments
Memory IC Applications
- Industrial control systems requiring robust memory solutions
- Embedded computing platforms operating in harsh thermal conditions
- Consumer electronics utilizing DDR3L interface standards
Memory IC Procurement Notes
Verify the specific suffix BIN against official datasheets to confirm the extended industrial temperature grade (-40°C to +95°C). Ensure compatibility with system voltage requirements, as this component operates within the 1.283 V to 1.45 V range. Confirm package dimensions match the 78-ball FBGA footprint during integration planning.
Memory IC Selection Notes
Select this component when an 8-bit wide DDR3L interface is required for 2 Gbit capacity. It is suitable for designs needing extended temperature stability compared to commercial variants. Consider the 78-ball FBGA form factor for space-constrained PCB layouts. Verify that the host controller supports the 800 MHz speed grade.
Memory IC Part Context
This part belongs to the Alliance Memory AS4C series of DDR3L synchronous dynamic random-access memories. The series offers various densities and bus widths optimized for modern embedded applications. The 'LB' designation typically indicates low-voltage operation, while the 'BIN' suffix specifies the industrial temperature rating and packaging configuration.
Memory IC Replacement Considerations
Cross-reference with other Alliance Memory parts sharing the same density and bus width but different temperature grades or packages. Verify pinout compatibility before substituting with similar industry-standard DDR3L components.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
