Memory IC AS4C32M32MD1-5BCNTR product image

AS4C32M32MD1-5BCNTR

  • Description:IC DRAM 1GBIT PARALLEL 90FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:eaa7f6cbd050 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

AS4C32M32MD1-5BCNTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 1GBIT PARALLEL 90FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C32M32MD1-5BCNTR

  • Description:IC DRAM 1GBIT PARALLEL 90FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:1Gbit
  • Memory Organization:32M x 32
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-25°C ~ 85°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:90-VFBGA
  • Supplier Device Package:90-FBGA (8x13)
  • Access Time:5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C32M32MD1-5BCNTR

AS4C32M32MD1-5BCNTR

Memory IC Overview

The AS4C32M32MD1-5BCNTR is a 1 Gbit Mobile LPDDR SDRAM manufactured by Alliance Memory, Inc. It features a 32-bit data bus width and supports clock frequencies up to 200 MHz. The device utilizes a 90-ball FBGA package with an 8x13 mm footprint. Electrical specifications include a minimum access time of 5 ns and an operating voltage range of 1.7 V to 1.95 V. The component is rated for commercial temperature operation between 0°C and +70°C.

Memory IC Feature Summary

  • Supports Mobile Low Power Double Data Rate (LPDDR) interface standards for reduced power consumption
  • Integrates 1 Gbit storage capacity organized as 32 Meg words by 32 bits
  • Utilizes a compact 90-ball Fine-Pitch Ball Grid Array package for space-constrained designs

Memory IC Applications

  • Mobile handheld devices requiring high-density memory
  • Portable consumer electronics with strict power constraints
  • Embedded systems utilizing LPDDR interfaces

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging configuration when ordering. Confirm that the '5B' speed grade matches the target system timing requirements. Ensure the 90-FBGA footprint aligns with the printed circuit board layout. Validate RoHS compliance status against current regulatory standards before final procurement approval.

Memory IC Selection Notes

Select this component for applications requiring 1 Gbit density in a small form factor. Compare performance against standard DDR1 or DDR2 options if power efficiency is critical. Ensure the controller supports the specific LPDDR signaling protocol. Verify thermal management capabilities within the 0°C to +70°C commercial temperature range.

Memory IC Part Context

This part belongs to the Alliance Memory AS4C32M32MD1 series of Mobile LPDDR devices. The series provides high-density memory solutions optimized for portable electronics. The manufacturer offers various speed grades and packaging options within this family to accommodate different design constraints and performance requirements.

Memory IC Replacement Considerations

Check for AS4C32M32MD1-5BINTR as a potential industrial temperature variant substitute. Verify pin compatibility and electrical characteristics before swapping components.

AS4C32M32MD1-5BCNTRAS4C32M32MD1-5BCNTR

Click on the inquiry