AS4C512M16D3LB-12BINTR

$20.61

Description：IC DRAM 8GBIT PARALLEL 96FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tape & Reel (TR)

SKU:1289ee602191 Category: Memory IC Brand: Alliance Memory, Inc.

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Product introduction

AS4C512M16D3LB-12BINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 8GBIT PARALLEL 96FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C512M16D3LB-12BINTR

Description：IC DRAM 8GBIT PARALLEL 96FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3L
Memory Size：8Gbit
Memory Organization：512M x 16
Memory Interface：Parallel
Clock Frequency：800 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.283V ~ 1.45V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：96-TFBGA
Supplier Device Package：96-FBGA (13.5x9)
Access Time：20 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for AS4C512M16D3LB-12BINTR

AS4C512M16D3LB-12BINTR

Memory IC Overview

The AS4C512M16D3LB-12BINTR is a 512 Meg x 16 Dynamic Random Access Memory (DRAM) component manufactured by Alliance Memory, Inc. It operates as DDR3L SDRAM with a maximum clock frequency of 800 MHz and an access time of 20 ns. The device supports a supply voltage range from 1.283 V to 1.45 V and functions within a temperature range of -40°C to +95°C. It utilizes a 96-ball FBGA package and is supplied in tape and reel format.

Memory IC Feature Summary

Supports low-voltage operation for reduced power consumption
Includes automatic and self-refresh capabilities
Complies with JEDEC clock jitter specifications

Memory IC Applications

Industrial control systems
Automotive electronics
Consumer devices requiring industrial-grade memory

Memory IC Procurement Notes

Verify the specific suffix BINTR against official datasheets to confirm tape and reel packaging and lead-free status. Ensure compatibility with system voltage requirements and thermal management solutions for the specified operating temperature range. Confirm moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this component when industrial temperature stability and low-power DDR3L performance are required. Compare pinout and electrical characteristics with existing designs to ensure seamless integration. Validate that the 96-ball FBGA footprint matches the target PCB layout constraints.

Memory IC Part Context

This part belongs to the AS4C512M16D3LB series, which offers high-density DRAM solutions. It serves as a drop-in replacement for similar industry-standard DDR3L parts, providing enhanced reliability for applications demanding robust data storage under varying environmental conditions.