AS4C512M8D3-12BIN

Memory IC Overview

The AS4C512M8D3-12BIN is a 4 Gbit DDR3 SDRAM manufactured by Alliance Memory, Inc. It features a memory organization of 512M x 8 and operates with an 8-bit data bus width. The component supports a maximum clock frequency of 800 MHz and has a typical access time of 20 ns. It is housed in a 78-ball FBGA package measuring 9x10.5 mm. The device is designed for commercial temperature ranges.

Memory IC Feature Summary

• Supports high-speed parallel data transfer via DDR3 interface
• Compact 78-ball FBGA footprint for space-constrained designs
• Operates at standard low-voltage levels for power efficiency

Memory IC Applications

• Embedded systems requiring volatile memory storage
• Industrial control units with commercial temperature requirements
• Consumer electronics utilizing DDR3 architecture

Memory IC Procurement Notes

Verify the specific suffix BIN against official datasheets to confirm pinout compatibility and thermal specifications. Ensure the source document explicitly lists this part number as active or available, as distribution status may vary. Cross-reference the 78-FBGA package dimensions with your PCB layout constraints before ordering.

Memory IC Selection Notes

Select this component when a 4 Gbit capacity with an 8-bit interface is required. The 800 MHz speed rating suits applications needing moderate bandwidth. Consider the commercial temperature range limits during system design. Compare against other DDR3 variants if industrial temperature ratings are necessary for harsh environments.

Memory IC Part Context

This part belongs to the Alliance Memory DDR3 SDRAM family. It shares architectural similarities with other AS4C512M series devices but differs in organization and package type. The 512M x 8 configuration distinguishes it from wider bus alternatives like the 16-bit variants within the same manufacturer lineup.

Memory IC Replacement Considerations

Check for direct substitutes such as the AS4C512M8D3-12BCNTR for tape-and-reel packaging options. Verify functional equivalence with other 78-FBGA DDR3 parts from different manufacturers if supply chain constraints exist.