AS4C64M16MD2A-25BCNTR

Memory IC Overview

The AS4C64M16MD2A-25BCNTR is a Mobile LPDDR2 SDRAM component manufactured by Alliance Memory, Inc. It offers a total storage capacity of 1 Gbit organized as 64 M x 16 bits. The device supports a maximum clock frequency of 400 MHz and utilizes a 134-pin FBGA package measuring 10x11.5 mm. It operates within a voltage range of 1.7 V to 1.9 V and functions at temperatures between 0°C and +85°C.

Memory IC Feature Summary

• Mobile Low Power Double Data Rate 2 (LPDDR2) architecture for reduced energy consumption
• Parallel interface supporting high-speed data transfer rates up to 400 MHz
• Compact 134-ball Fine-pitch Ball Grid Array (FBGA) footprint for space-constrained designs

Memory IC Applications

• Portable consumer electronics requiring low power memory
• Embedded systems with limited board real estate
• Mobile communication devices utilizing parallel DRAM interfaces

Memory IC Procurement Notes

Verify the specific suffix 'CNTR' indicates tape-and-reel packaging when sourcing components. Confirm that the operating temperature range meets your environmental requirements. Ensure compatibility with the host system's voltage levels and signal integrity standards before integration. Cross-reference the datasheet revision to confirm pinout consistency.

Memory IC Selection Notes

Select this part for applications demanding high density in a small form factor. The LPDDR2 technology provides efficiency advantages over standard DDR2. Consider the 134-pin package constraints during PCB layout. Evaluate thermal management needs given the commercial temperature range limitations.

Memory IC Part Context

This component belongs to the AS4C64M16MD2A series of Mobile LPDDR2 memories from Alliance Memory. It complements other variants in the lineup offering different densities or organizational structures. The series targets the mobile market segment where power efficiency and physical size are critical design parameters.

Memory IC Replacement Considerations

Check for direct substitutes within the same manufacturer's portfolio. Verify electrical compatibility and pin assignments before swapping. Alternative packages may require schematic modifications.