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AS4C64M4SA-6TINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 256MBIT PAR 54TSOP II. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AS4C64M4SA-6TINTR
- Description：IC DRAM 256MBIT PAR 54TSOP II
- Series：-
- Mfr：Alliance Memory, Inc.
- Package：Tape & Reel (TR)
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM
- Memory Size：256Mbit
- Memory Organization：64M x 4
- Memory Interface：Parallel
- Clock Frequency：166 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：3V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：54-TSOP (0.400", 10.16mm Width)
- Supplier Device Package：54-TSOP II
- Access Time：5 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AS4C64M4SA-6TINTR
Memory IC Overview
The AS4C64M4SA-6TINTR is a 256 Mbit Synchronous Dynamic Random Access Memory (SDRAM) manufactured by Alliance Memory. It features a 4-bit data bus width and an organization of 64 Meg x 4. The component supports a maximum clock frequency of 166 MHz with a typical access time of 5 ns. It operates within a voltage range of 3 V to 3.6 V. The device is housed in a 54-pin TSOP-II package and is rated for industrial temperature operation between -40°C and +85°C.
Memory IC Feature Summary
- Supports high-speed synchronous data transfer via a single data rate interface.
Memory IC Applications
- Industrial control systems requiring robust memory solutions.
Memory IC Procurement Notes
Verify the specific suffix 'INTR' against official datasheets to confirm tape and reel packaging and industrial temperature grade specifications. Ensure compatibility with system voltage requirements of 3V to 3.6V. Confirm that the 54-pin TSOP-II footprint matches the target PCB design constraints before finalizing procurement orders.
Memory IC Selection Notes
Select this component when a 256 Mbit capacity with a narrow 4-bit bus width is required for space-constrained designs. The TSOP-II package offers a surface-mount solution suitable for automated assembly processes. Consider the 166 MHz speed grade if higher throughput is needed compared to slower variants within the same series.
Memory IC Part Context
This part belongs to the AS4C64M4SA series of SDRAM devices from Alliance Memory. The series provides various density and speed options tailored for embedded applications. The TSOP-II form factor is commonly used in legacy and industrial electronics where board space is limited but standard mounting techniques are preferred over BGA packages.
Memory IC Replacement Considerations
Check for pin-compatible alternatives such as other 54-pin TSOP-II SDRAMs with matching 4-bit widths and similar access times. Verify electrical characteristics including voltage ranges and operating temperatures to ensure functional equivalence in existing designs.
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