Memory IC AS4C64M8D1-5TINTR product image

AS4C64M8D1-5TINTR

$3.27
  • Description:IC DRAM 512MBIT PAR 66TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:7ef943cf71c9 Category: Brand:

  
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AS4C64M8D1-5TINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 512MBIT PAR 66TSOP II. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C64M8D1-5TINTR

  • Description:IC DRAM 512MBIT PAR 66TSOP II
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR
  • Memory Size:512Mbit
  • Memory Organization:64M x 8
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:2.3V ~ 2.7V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:66-TSSOP (0.400", 10.16mm Width)
  • Supplier Device Package:66-TSOP II
  • Access Time:700 ps
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C64M8D1-5TINTR

AS4C64M8D1-5TINTR

Memory IC Overview

The AS4C64M8D1-5TINTR is a 512 Mbit DDR SDRAM component manufactured by Alliance Memory. It features an organization of 64 Megabit x 8 bits and operates with a maximum clock frequency of 200 MHz. The device utilizes a TSOP-II-66 surface-mount package. Electrical specifications include a supply voltage range from 2.3 V to 2.7 V, with a typical operating voltage of 2.5 V. Access time is specified at 700 ps. The component supports commercial temperature operation ranging from 0°C to +70°C and includes humidity sensitivity classification.

Memory IC Feature Summary

  • Supports double data rate synchronous dynamic random access memory architecture for high-speed data transfer
  • Integrates 512 Mbit storage capacity within a compact 66-pin thin small-outline package
  • Operates on standard 2.5V power supply rails compatible with common logic levels

Memory IC Applications

  • Embedded systems requiring moderate density volatile memory
  • Industrial control units operating in commercial temperature environments
  • Consumer electronics utilizing DDR interface protocols

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm tape-and-reel packaging configuration. Ensure that the selected variant matches the required commercial temperature grade and voltage specifications for the target application environment before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 512 Mbit density is required alongside a 66-pin TSOP-II form factor. Confirm compatibility with 200 MHz system clocks and 2.5V power domains. Evaluate thermal requirements to ensure the commercial temperature range meets operational needs.

Memory IC Part Context

This part belongs to the AS4C64M8D1 series of DDR SDRAM devices. The series offers various packaging and temperature options. This specific model provides a surface-mount solution suitable for automated assembly processes while maintaining standard DDR electrical characteristics.

Memory IC Replacement Considerations

Check for other suffixes within the AS4C64M8D1 family that offer different packaging or temperature ratings. Verify pinout compatibility if substituting with similar density parts from other manufacturers.

AS4C64M8D1-5TINTRAS4C64M8D1-5TINTR
$3.27
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