AS4C64M8D2-25BIN

$4.77

Description：IC DRAM 512MBIT PARALLEL 60FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray

SKU:25dd3b759f1d Category: Memory IC Brand: Alliance Memory, Inc.

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Product introduction

AS4C64M8D2-25BIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 512MBIT PARALLEL 60FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C64M8D2-25BIN

Description：IC DRAM 512MBIT PARALLEL 60FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR2
Memory Size：512Mbit
Memory Organization：64M x 8
Memory Interface：Parallel
Clock Frequency：400 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.7V ~ 1.9V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：60-TFBGA
Supplier Device Package：60-FBGA (8x10)
Access Time：400 ps
Grade：-
Qualification：-

Memory IC datasheet and documents for AS4C64M8D2-25BIN

AS4C64M8D2-25BIN

Memory IC Overview

The AS4C64M8D2-25BIN is a 512 Mbit DDR2 SDRAM manufactured by Alliance Memory. It features an 8-bit data bus width and a 64M x 8 organization. The device supports a maximum clock frequency of 400 MHz with a typical access time of 400 ps. Operating voltage ranges from 1.7 V to 1.9 V. It is housed in a 60-ball FBGA package and is rated for industrial temperature operation.

Memory IC Feature Summary

Supports high-speed DDR2 synchronous dynamic random access memory operations
Designed for industrial temperature range applications
Utilizes a compact 60-ball FBGA surface-mount package

Memory IC Applications

Industrial embedded systems requiring DRAM storage
Consumer electronics utilizing DDR2 interfaces
General-purpose digital signal processing hardware

Memory IC Procurement Notes

Verify the specific suffix BIN against official Alliance Memory documentation to confirm exact pinout, speed grade, and environmental ratings. Ensure compatibility with system power supply rails within the 1.7 V to 1.9 V operating range. Confirm package dimensions match PCB footprint requirements before procurement.

Memory IC Selection Notes

Select this component when a 512 Mbit capacity with an 8-bit interface is required. Consider the 400 MHz maximum frequency for bandwidth needs. Verify that the host system supports DDR2 signaling standards and can provide the specified 1.8 V nominal voltage. Check if the industrial temperature rating aligns with the deployment environment.

Memory IC Part Context

This part belongs to the Alliance Memory AS4C series of DDR2 SDRAMs. It offers 512 Mbit density suitable for mid-range memory applications. The series provides various organizational options and package types to accommodate different design constraints and performance requirements.