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AS4C8M16D1-5BCN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 128MBIT PAR 60TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AS4C8M16D1-5BCN
- Description：IC DRAM 128MBIT PAR 60TFBGA
- Series：-
- Mfr：Alliance Memory, Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：DRAM
- Technology：SDRAM - DDR
- Memory Size：128Mbit
- Memory Organization：8M x 16
- Memory Interface：Parallel
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：15ns
- Voltage - Supply：2.3V ~ 2.7V
- Operating Temperature：0°C ~ 70°C (TA)
- Mounting Type：Surface Mount
- Package / Case：60-TFBGA
- Supplier Device Package：60-TFBGA (8x13)
- Access Time：700 ps
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AS4C8M16D1-5BCN
Memory IC Overview
The AS4C8M16D1-5BCN is a 128 Mbit (8 M x 16) DDR SDRAM component manufactured by Alliance Memory. It operates with a maximum clock frequency of 200 MHz and features a 700 ps access time. The device utilizes a 60-ball TFBGA package for surface mount installation. Electrical specifications include a supply voltage range of 2.3 V to 2.7 V, with a maximum power current of 65 mA. It supports commercial temperature operation from 0°C to +70°C.
Memory IC Feature Summary
- Supports Double Data Rate synchronous dynamic random access memory architecture for high-speed data transfer.
- Integrated refresh controller manages internal row refresh cycles automatically.
- Compatible with standard DDR SDRAM interface protocols for system integration.
Memory IC Applications
- Embedded systems requiring compact memory solutions
- Consumer electronics devices
- Industrial control equipment
Memory IC Procurement Notes
Verify the specific suffix BCN confirms the TFBGA-60 package and commercial temperature grade against official datasheets. Confirm RoHS compliance status through manufacturer documentation. Ensure ESD handling procedures are followed during assembly due to humidity sensitivity classification. Validate pinout compatibility with target PCB layout designs prior to procurement.
Memory IC Selection Notes
Select this component when a 128 Mbit capacity with a 16-bit bus width is required in a low-profile TFBGA form factor. Consider the 200 MHz speed rating for applications needing moderate bandwidth within commercial temperature limits. Evaluate the 2.5V nominal supply requirement against available power rails in the design.
Memory IC Part Context
This part belongs to the AS4C8M16D1 series of DDR SDRAMs from Alliance Memory. The series offers various density and package options for embedded memory needs. The -5BCN suffix denotes specific packaging and environmental ratings within this product line.
Memory IC FAQ
What is the maximum operating frequency?
The maximum clock frequency is 200 MHz.
What is the package type?
The component uses a 60-ball Thin Fine-Pitch Ball Grid Array (TFBGA) package.
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