Memory IC AS6C1008-55STIN product image

AS6C1008-55STIN

$2.52
  • Description:IC SRAM 1MBIT PARALLEL 32STSOP
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray

SKU:7d8fc9f7d3b5 Category: Brand:

  
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AS6C1008-55STIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC SRAM 1MBIT PARALLEL 32STSOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS6C1008-55STIN

  • Description:IC SRAM 1MBIT PARALLEL 32STSOP
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Asynchronous
  • Memory Size:1Mbit
  • Memory Organization:128K x 8
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:55ns
  • Voltage - Supply:2.7V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:32-LFSOP (0.465", 11.80mm Width)
  • Supplier Device Package:32-sTSOP
  • Access Time:55 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS6C1008-55STIN

AS6C1008-55STIN

Memory IC Overview

The AS6C1008-55STIN is a 1 Mbit (128K x 8) asynchronous static random-access memory (SRAM) manufactured by Alliance Memory. It features a maximum access time of 55 ns and operates within a supply voltage range of 2.7 V to 5.5 V. The device utilizes a parallel interface with a 17-bit address bus and draws a maximum supply current of 60 mA. It is housed in a 32-pin Thin Shrink Small Outline Package (TSOP II) designed for surface-mount technology. The component supports an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Provides high-speed data access with a 55 ns maximum cycle time for efficient system performance.
  • Supports wide voltage operation from 2.7 V to 5.5 V, ensuring compatibility with various logic families.
  • Features low power consumption characteristics suitable for battery-powered or energy-efficient applications.
  • Designed for industrial environments with reliable operation across extended temperature ranges.

Memory IC Applications

  • Industrial control systems requiring robust memory solutions
  • Consumer electronics devices utilizing standard logic interfaces
  • Telecommunications equipment needing fast data buffering
  • Automotive embedded systems operating in harsh environments

Memory IC Procurement Notes

Verify the specific suffix STIN confirms the TSOP II package and lead-free status against official datasheets. Confirm RoHS compliance requirements match project specifications. Ensure the 55 ns speed grade aligns with system timing constraints. Check for moisture sensitivity levels if reflow soldering is planned. Validate that the 128K x 8 organization fits the memory map design.

Memory IC Selection Notes

Select this part when a 1 Mbit capacity with 55 ns speed is required in a compact surface-mount package. Compare against other Alliance Memory SRAMs for pin compatibility and power needs. Consider the 2.7 V minimum voltage for low-power designs. Evaluate the TSOP II footprint against PCB space limitations. Verify industrial temperature rating suffices for the target application environment.

Memory IC Part Context

This component belongs to the AS6C1008 series of low-power CMOS SRAMs. It offers non-volatile-like retention without the complexity of flash programming. The series provides a drop-in replacement for many legacy SRAMs. It is widely used in embedded systems where fast read/write cycles are critical. The manufacturer ensures long-term availability for industrial applications.

Memory IC Replacement Considerations

Check for direct pin-compatible alternatives within the same speed grade. Verify voltage tolerance matches existing circuitry. Ensure package dimensions allow for physical substitution. Review updated datasheets for any functional changes in newer revisions.

AS6C1008-55STINAS6C1008-55STIN
$2.52
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