Memory IC AS6C3216-55BINTR product image

AS6C3216-55BINTR

  • Description:IC SRAM 32MBIT PARALLEL 48TFBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)

SKU:2cff4917f0af Category: Brand:

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AS6C3216-55BINTR is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC SRAM 32MBIT PARALLEL 48TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS6C3216-55BINTR

  • Description:IC SRAM 32MBIT PARALLEL 48TFBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Asynchronous
  • Memory Size:32Mbit
  • Memory Organization:2M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:55ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-LFBGA
  • Supplier Device Package:48-TFBGA (8x10)
  • Access Time:55 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS6C3216-55BINTR

AS6C3216-55BINTR

Memory IC Overview

The AS6C3216-55BINTR is a 32 Mbit (2048K x 16) low-power CMOS static random-access memory manufactured by Alliance Memory. It operates within a voltage range of 2.7 V to 3.6 V and features a maximum access time of 55 ns. The device utilizes a parallel interface and is housed in a TFBGA-48 surface-mount package. It supports single data rate asynchronous operation with a maximum supply current of 20 mA. The component is rated for an industrial temperature range from -40°C to +85°C and includes humidity sensitivity characteristics.

Memory IC Feature Summary

  • Low power consumption design optimized for 3V operation
  • Asynchronous parallel interface for standard memory integration
  • Industrial temperature rating for robust environmental performance

Memory IC Applications

  • Embedded systems requiring non-volatile-like speed without retention
  • Industrial control units operating in wide temperature ranges
  • Consumer electronics utilizing 3V logic families

Memory IC Procurement Notes

Verify the specific suffix BINTR confirms the TFBGA-48 package and reel packaging format, as these define physical compatibility and handling requirements. Confirm the 3V variant specification against system power rails, as other variants in the series support wider voltage ranges. Ensure ESD protection protocols are followed during assembly due to humidity sensitivity classification.

Memory IC Selection Notes

Select this component when a 32 Mbit capacity with 16-bit width is required in a compact TFBGA footprint. It is suitable for designs prioritizing lower power draw compared to standard 5V SRAMs while maintaining 55 ns performance. Consider the 3V operating range strictly; if 5V tolerance is needed, a different model from the AS6C series must be chosen.

Memory IC Part Context

This part belongs to the AS6C3216 series of low-power CMOS SRAMs. It shares architectural similarities with other members like the AS6C3216A-55BINTR but may differ in revision history or specific electrical characteristics defined by Alliance Memory. The BINTR suffix indicates the specific tape-and-reel packaging configuration for automated surface-mount assembly.

Memory IC Replacement Considerations

The AS6C3216A-55BINTR is a documented related variant within the same family. Verify pinout compatibility and specific electrical parameter differences before substitution.

AS6C3216-55BINTRAS6C3216-55BINTR

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