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The AS6C8008-55BINTR is an asynchronous static random-access memory (SRAM) device manufactured by Alliance Memory. It provides a total storage capacity of 8 Mbit, organized as 1M words by 8 bits. The component features a maximum random access time of 55 ns and operates within a supply voltage range of 2.7 V to 5.5 V. It utilizes a parallel interface with a 20-bit address bus. The device is housed in a 44-pin Thin Fine-pitch Ball Grid Array (TFBGA) package designed for surface-mount technology. It supports an industrial operating temperature range from -40°C to +85°C.
Verify the exact suffix BINTR against official manufacturer documentation to confirm the specific tape-and-reel packaging configuration and die revision. Ensure the selected variant matches the required TFBGA pinout and thermal specifications for your application. Cross-reference the part number with current datasheets to confirm active status and availability constraints before finalizing procurement plans.
Select this component when an 8 Mbit asynchronous SRAM with 55 ns access speed is required in a compact BGA form factor. Consider the 2.7 V to 5.5 V operating range for compatibility with standard logic levels. Evaluate the TFBGA-44 package for suitable PCB real estate and thermal management requirements compared to TSOP or DIP alternatives within the same memory family.
This part belongs to the AS6C8008 series of low-power asynchronous SRAMs from Alliance Memory. The series offers various access speeds and package options to suit different design needs. The AS6C8008-55BINTR specifically targets applications requiring robust performance in industrial conditions while maintaining a small footprint through its ball grid array construction.
Check for AS6C8008-55ZIN for TSOP II package equivalents. Verify AS6C8008A-45ZIN for faster 45 ns access times in similar packages. Confirm pin compatibility and electrical characteristics before substituting any alternative part numbers.