AS7C3513B-15TCN

$3.18

Description：IC SRAM 512KBIT PARALLEL 44TSOP2
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray

SKU:d222ddd064ee Category: Memory IC Brand: Alliance Memory, Inc.

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Product introduction

AS7C3513B-15TCN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC SRAM 512KBIT PARALLEL 44TSOP2. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS7C3513B-15TCN

Description：IC SRAM 512KBIT PARALLEL 44TSOP2
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Asynchronous
Memory Size：512Kbit
Memory Organization：32K x 16
Memory Interface：Parallel
Clock Frequency：-
Write Cycle Time - Word, Page：15ns
Voltage - Supply：3V ~ 3.6V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：44-TSOP (0.400", 10.16mm Width)
Supplier Device Package：44-TSOP2
Access Time：15 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for AS7C3513B-15TCN

AS7C3513B-15TCN

Memory IC Overview

The AS7C3513B-15TCN is a 512-kbit Static Random Access Memory (SRAM) organized as 32K words by 16 bits. It features a parallel asynchronous interface with a maximum access time of 15 ns. The device operates within a supply voltage range of 3 V to 3.6 V and draws a maximum current of 70 mA. It is housed in a 44-pin TSOP II surface-mount package and supports Single Data Rate (SDR) storage type. The component is rated for commercial operating temperatures between 0°C and +70°C.

Memory IC Feature Summary

Asynchronous parallel interface for direct memory access
Single data rate (SDR) operation mode
Surface-mount TSOP II packaging for compact integration

Memory IC Applications

Embedded systems requiring fast local data storage
Industrial control units needing volatile memory buffers
Consumer electronics with 3.3V logic interfaces

Memory IC Procurement Notes

Verify the specific suffix TCN confirms the 44-pin TSOP II package and commercial temperature grade. Confirm RoHS compliance status through official manufacturer documentation before procurement. Ensure design compatibility with 3.3V logic levels and 15 ns timing requirements. Check humidity sensitivity handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 32K x 16 organization is required for 3.3V applications. Compare against other speed grades if faster access times are needed. Consider the TSOP II footprint constraints versus alternative packages like SOJ or BGA. Verify power consumption limits against system thermal budgets.

Memory IC Part Context

This part belongs to the Alliance Memory SRAM family, designed for general-purpose high-speed data storage. It complements other devices in the series with varying densities and pin configurations. The AS7C3513B variant specifically targets mid-range capacity needs in embedded architectures.