ASFC4G31M-51BIN

$5.56

Description：IC FLASH 32GBIT MMC 153FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray

SKU:d393ab71575a Category: Memory IC Brand: Alliance Memory, Inc.

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Product introduction

ASFC4G31M-51BIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC FLASH 32GBIT MMC 153FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for ASFC4G31M-51BIN

Description：IC FLASH 32GBIT MMC 153FBGA
Series：-
Mfr：Alliance Memory, Inc.
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND
Memory Size：32Gbit
Memory Organization：4G x 8
Memory Interface：MMC
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：153-VFBGA
Supplier Device Package：153-FBGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for ASFC4G31M-51BIN

ASFC4G31M-51BIN

Memory IC Overview

The ASFC4G31M-51BIN is an industrial-grade embedded multi-media card (eMMC) solution from Alliance Memory, Inc. Compliant with the JEDEC eMMC v5.1 standard, this component integrates NAND flash memory, an eMMC controller, and Flash Translation Layer (FTL) management software within a single package. It operates reliably in temperatures ranging from -40°C to +85°C. The device utilizes a 153-ball FBGA package measuring 11.5mm by 13mm, designed for solid-state storage applications requiring robust performance in consumer, industrial, and networking environments.

Memory IC Feature Summary

Integrates NAND flash memory, eMMC controller, and FTL management software in a single package
Compliant with JEDEC eMMC v5.1 standard
Operates within industrial temperature range of -40°C to +85°C

Memory IC Applications

Consumer electronics solid-state storage
Industrial system data storage
Networking equipment memory solutions

Memory IC Procurement Notes

Verify the specific binning designation and manufacturing date code upon order confirmation. Confirm that the 153-ball FBGA footprint matches the target PCB layout. Ensure thermal management strategies accommodate the specified industrial operating temperature range. Validate compatibility with the host controller's eMMC v5.1 interface requirements before finalizing procurement.

Memory IC Selection Notes

Select this model when industrial temperature stability (-40°C to +85°C) is required alongside JEDEC eMMC v5.1 compliance. The integrated controller and FTL simplify design complexity compared to discrete NAND solutions. Consider the 153-ball FBGA package dimensions for space-constrained industrial or networking board layouts. Verify power supply constraints align with standard eMMC voltage levels.

Memory IC Part Context

This component belongs to Alliance Memory's industrial-grade eMMC product line, which combines NAND flash with advanced controller technology. It targets markets demanding reliable non-volatile storage under harsh environmental conditions. The integration of FTL software manages wear leveling and error correction internally, enhancing longevity and performance consistency for embedded systems.