ASFC64G31T5-51BIN

Memory IC Overview

The ASFC64G31T5-51BIN is a 64GB embedded multimedia card (eMMC) manufactured by Alliance Memory. It utilizes TLC Gen5 NAND flash technology and operates within an industrial temperature range of -40°C to +85°C. The device features a 153-ball FBGA package measuring 11.5mm x 13mm. It supports eMMC 5.1 interface standards with a power supply voltage range of 2.7V to 3.6V. Sequential read performance reaches 301 MB/s, while sequential write performance achieves 222 MB/s.

Memory IC Feature Summary

• Integrates NAND flash memory with an eMMC controller and Flash Translation Layer management software in a single package.
• Compliant with JEDEC eMMC v5.1 industry standard specifications.
• Supports enhanced strobe features for faster and more reliable operation.
• Includes boot operation capabilities and replay protected memory block (RPMB) support.

Memory IC Applications

• Consumer solid-state storage devices
• Industrial embedded systems
• Networking equipment

Memory IC Procurement Notes

Verify the specific suffix 'BIN' against official datasheets to confirm industrial temperature rating and packaging type. Ensure compatibility with host controllers supporting eMMC 5.1 and HS400 modes. Confirm that the 153-ball FBGA footprint matches the target PCB design. Validate power requirements align with the 2.7V to 3.6V operating range. Check for any specific field firmware update procedures required during integration.

Memory IC Selection Notes

Select this component when high-density storage is required alongside robust industrial environmental tolerance. The TLC Gen5 NAND offers a balance of capacity and endurance suitable for demanding applications. Consider the 153-ball FBGA form factor for space-constrained designs. Verify that the host system supports the necessary eMMC 5.1 features such as RPMB and boot partitions. Evaluate thermal management needs given the industrial temperature specification.

Memory IC Part Context

This part belongs to the Alliance Memory ASFC series of embedded multimedia cards. The series integrates NAND flash and controller technology into compact packages. Other variants in the family include different capacities and NAND types, such as MLC configurations. The ASFC64G31T5-51BIN specifically targets industrial and networking sectors requiring reliable data retention.

Memory IC Replacement Considerations

Direct substitutes may include other 64GB eMMC 5.1 devices in 153-ball FBGA packages from manufacturers like Samsung or Kioxian. Ensure pinout compatibility and electrical characteristics match. Verify that alternative parts support the same industrial temperature range and feature set, including RPMB and enhanced strobe functionality.