ASM3P2107AF-08SR

Overview

The ASM3P2107AF-08SR is a spread spectrum frequency modulator designed for input clock frequencies between 12 MHz and 22 MHz. It generates a low EMI output by spreading the bandwidth of synthesized clocks, reducing peak harmonic amplitudes. The device operates on a 5.0V ± 5% supply voltage and features an internal loop filter to minimize external components. It provides TTL or CMOS compatible outputs with a typical frequency deviation of -0.8% at 20 MHz. The component is housed in an 8-pin SOIC package.

Feature Summary

• Generates 1X low EMI spread spectrum clock from input frequencies of 12MHz to 22MHz
• FCC approved method of EMI attenuation using proprietary all-digital modulation
• Internal loop filter reduces external component count and board space requirements
• Low cycle-to-cycle jitter of ±360 pS typical

Applications

• EMI management for PC peripheral devices
• Consumer electronics systems
• Embedded controller systems

Procurement Notes

Verify the ordering suffix 'AF-08SR' corresponds to the 8-pin SOIC tape and reel packaging configuration. Confirm the temperature range matches the specified 0°C to +70°C operating limit. Ensure the part marking 'AEE' aligns with the required identification for this specific variant.

Selection Notes

Select this component when input clock frequencies fall within the 12 MHz to 22 MHz range. Verify that the system requires a 5V supply voltage compatible with the 4.75V to 5.25V operating window. Ensure the application can accommodate the 8-pin SOIC package dimensions and thermal characteristics.

Part Context

This part belongs to the ASM3P2107A family of spread spectrum clock generators. The base model ASM3P2107A offers similar functionality across different package options, including TSSOP. The AF-08SR designation specifically identifies the surface-mount SOIC version intended for automated assembly processes.

Replacement Considerations

Direct replacements include other variants within the ASM3P2107A series, such as those in TSSOP packages, provided the pinout compatibility and package footprint requirements are met. Cross-model substitution requires verification of the specific package type and temperature rating.