AT-1592-808-M-2133

Overview

The AT-1592-808-M-2133 is a high-density interconnect solution manufactured by Samtec Inc. It belongs to the Flex Stack product family, designed for flexible surface mount board stacking applications. This component features a 2 mm pitch with 32 positions arranged in two rows. It utilizes solder pin termination and operates at vertical installation angles. The connector supports data rates up to 4 Gb/s and 8 Gb/s, with a current rating of 5.2 A. Constructed with phosphor bronze contacts gold-plated for reliability, it uses liquid crystal polymer (LCP) housing. Operating temperatures range from -55°C to +125°C, ensuring stability in demanding environments.

Feature Summary

• Flexible surface mount design allows for adaptable board stacking configurations
• High-speed signal transmission capability supporting 4 Gb/s and 8 Gb/s data rates
• Robust construction using gold-plated phosphor bronze contacts within an LCP housing

Applications

• High-performance computing systems requiring dense interconnects
• Semiconductor manufacturing equipment interfaces
• Quantum computing hardware connections

Procurement Notes

Verify the specific ordering suffix against official Samtec documentation to ensure correct pin count, stack height, and termination style. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration. Cross-reference the manufacturer part number with authorized distributor databases to validate authenticity and technical specifications before procurement.

Selection Notes

Select this component when flexible board-to-board connectivity is required in space-constrained designs. Ensure the 2 mm pitch aligns with the target PCB footprint. Verify that the 5.2 A current rating and 8 Gb/s data rate meet system performance needs. Consider the vertical orientation and surface mount package type for assembly compatibility.

Part Context

This part is part of Samtec's Flex Stack series, which specializes in flexible micro board stackers. The TW series shares similar structural characteristics but may differ in pitch or row configuration. The AT-1592-808-M-2133 specifically addresses high-density stacking needs in computer and semiconductor applications, offering a balance of flexibility and electrical performance.

Replacement Considerations

Consult Samtec's cross-reference tools for parametrically similar parts. Verify that any substitute matches the 2 mm pitch, 32-position count, and 8 Gb/s data rate capabilities. Ensure mechanical dimensions and termination styles are compatible with existing PCB layouts.