AT-3195-807-01

Overview

AT-3195-807-01 is a flexible board stacking header manufactured by Samtec Inc. It features a 2.00 mm pitch and utilizes the FleXYZ™ high-density interconnect technology. The component is designed for board-to-board applications requiring high I/O density in compact spaces. It supports through-hole termination and offers customizable stack heights to accommodate various PCB assembly requirements.

Feature Summary

• FleXYZ™ high-density array architecture
• Flexible board stacking capability
• 2.00 mm pitch design

Applications

• High-density board-to-board interconnects
• Compact electronic system integration
• Customizable stack height assemblies

Procurement Notes

Verify the specific configuration against official series documentation before finalizing designs. Confirm compliance with environmental standards such as RoHS and REACH via manufacturer declarations. Ensure mating connector compatibility and validate mechanical fit using provided CAD models or 3D previews prior to implementation.

Selection Notes

Select this component when space constraints necessitate a 2.00 mm pitch solution. Evaluate required stack height and pin count against available configurations. Consider signal integrity needs and verify that the flexible header design meets the mechanical stress requirements of the target application environment.

Part Context

This part belongs to Samtec's FleXYZ™ family, which specializes in high-density interconnect solutions. The series addresses modern electronics demands for increased connectivity within reduced form factors. It complements other Samtec offerings by providing specialized board-stacking capabilities for complex multi-layer systems.

Replacement Considerations

Consult official substitution guides for verified alternatives. Generic equivalents may not match the precise pitch or mechanical flexibility. Verify that any substitute maintains the required 2.00 mm spacing and compatible termination style.