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AT97SC3204S-X2AC-10 is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC CRYPTO TPM LPC 28TSSOP. Review the specifications below when checking this part for your BOM.
The AT97SC3204S-X2AC-10 is a security integrated circuit implementing the Trusted Computing Group (TCG) Trusted Platform Module (TPM) Version 1.2 specification. It features an AVR RISC microprocessor and a hardware asymmetric crypto engine capable of performing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. The SHA-1 accelerator processes data at 20µs per 64-byte block. The device communicates via a 33MHz LPC bus, includes a FIPS 140-2 compliant True Random Number Generator, and provides 1280 bytes of NV storage for user-defined data. It operates on a 3.3V supply voltage.
Verify package configuration against design requirements, as the component is available in 28-lead Thin TSSOP, Wide TSSOP, or 40-lead QFN packages. Confirm temperature range suitability, noting that commercial and industrial grades are offered. Ensure the ordering suffix matches the specific package and operating range needed for the application.
Select based on required package type: 28A2 for Thin TSSOP, 28A3 for standard TSSOP, or 40ML1 for QFN. Verify operating temperature range; the datasheet specifies Commercial (0°C to 70°C) and Industrial (-40°C to 85°C) options. Ensure system supports the 33MHz LPC interface and 3.3V supply voltage constraints.
This component belongs to the AT97SC3204 series of security ICs manufactured by Microchip Technology (formerly Atmel). It serves as a turnkey solution for OEMs and ODMs, integrating firmware and device drivers to facilitate implementation in PC client platforms and embedded systems adhering to TCG standards.
Direct replacements within the same family include variants with different package codes such as AT97SC3204-28A2, AT97SC3204-28A3, or AT97SC3204-40ML1. Cross-package substitution requires verifying pinout compatibility and physical footprint dimensions.
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