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ATB3225-75032CT-T000 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 5MHZ-100MHZ 75/75 1210. Review the specifications below when checking this part for your BOM.
The ATB3225-75032CT-T000 is a compact, RoHS-compliant balun transformer designed for surface-mount applications in the 1210 (3225 metric) package. It operates within a frequency range of 5 MHz to 100 MHz and provides a 3:2 impedance transformation ratio with balanced-to-unbalanced conversion. The component features a 75/75 ohm impedance configuration, making it suitable for RF signal processing tasks requiring precise impedance matching and signal integrity maintenance in high-frequency circuits.
Verify the complete part number including the suffix -T000 to ensure correct reel packaging and active status. Confirm RoHS compliance requirements match your manufacturing standards. Check for any specific handling instructions related to ESD sensitivity during assembly. Ensure the supplier provides original manufacturer documentation to validate authenticity and traceability.
Select this component when a 1210 footprint is required for space-constrained designs. Choose this model specifically for its 75/75 ohm impedance specification and 3:2 ratio. Consider the 5-100 MHz operational bandwidth against your system's frequency needs. Evaluate the balance between size constraints and RF performance requirements for your specific application.
This balun belongs to TDK's ATB series of audio and signal transformers. The series offers various impedance ratios and frequency ranges tailored for different RF applications. The 1210 package size allows for automated pick-and-place assembly, supporting high-volume manufacturing processes while maintaining consistent electrical performance across production batches.
Consult official TDK documentation for verified substitute part numbers within the ATB series. Cross-reference impedance ratios and frequency ranges to ensure functional compatibility. Verify package dimensions and pin configurations before implementing any alternative components.
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