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ATC2525CT-0100JN-94TR is listed in the Attenuators range at ChipApex. The manufacturer field lists Vishay Barry. Its product description is DC-2GHZ 15W AL2O3 CHIP ATTENUATO. Review the specifications below when checking this part for your BOM.
The ATC2525CT-0100JN-94TR is a fixed RF attenuator manufactured by Vishay Barry. It provides an attenuation value of 1dB with a tolerance of 5%. The component operates within a frequency range of 0 Hz to 2 GHz and supports a maximum power handling capacity of 15W. It features a 50 Ohm impedance and utilizes Aluminum Oxide (Al2O3) as the dielectric material. The device is housed in a 4-SMD, no-lead package designed for surface mount technology.
Verify the specific ordering suffix against official Vishay Barry documentation to ensure correct material composition and termination finish. Confirm that the Al2O3 variant matches system requirements, as BeO alternatives exist within the same family. Cross-reference the RoHS status and environmental classifications with current regulatory standards before finalizing procurement orders.
Select this component when a low attenuation value of 1dB is required for high-power applications up to 15W. Ensure the operating environment remains within the specified temperature range of -55°C to +150°C. Verify that the 4-SMD footprint aligns with the target PCB layout constraints and that the DC-to-2 GHz bandwidth satisfies the application's spectral requirements.
This part belongs to the ATC2525CT series of chip attenuators from Vishay Barry. The series offers various attenuation values and power ratings using different substrate materials. This specific model represents the Aluminum Oxide construction variant, distinguishing it from Beryllium Oxide versions which offer higher power handling capabilities but differ in material properties and cost structures.
The ATC2525CT-0100JN-99TR is a documented alternative within the same product family, featuring Beryllium Oxide construction and a 30W power rating. Substitution requires verification of thermal management capabilities and potential differences in substrate material properties.
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