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ATIGGBL2L52580-100 is listed in the Antennas RF range at ChipApex. The manufacturer field lists YIC. Its product description is ANT GPS L1+L2+L5/GLONASS/BEIDOU. Review the specifications below when checking this part for your BOM.
The YIC ATIGGBL2L52580-100 is a multi-band GNSS ceramic patch antenna supporting GPS L1, L2, and L5 frequencies. It operates at center frequencies of 1.227GHz, 1.561GHz, 1.57542GHz, and 1.602GHz within the UHF band. The component features an integrated Low Noise Amplifier (LNA) with a standard gain of 27dB across two stages. It utilizes Right-Hand Circular Polarization (RHCP) and provides a typical antenna gain of 2dBi. The unit includes a 100mm cable terminated with an I-PEX(F) connector and employs adhesive mounting with a maximum height of 4.00mm.
Verify the specific frequency bands and connector type against system requirements before procurement. Confirm that the integrated LNA power supply matches the host circuit design. Ensure the adhesive mounting surface is compatible with the intended application environment to maintain signal integrity and physical stability during operation.
Select this model when comprehensive multi-constellation support including L5 frequencies is required. The integrated LNA simplifies RF front-end design by reducing external component count. Consider the low profile and adhesive mounting for space-constrained applications where mechanical robustness and minimal height are critical constraints.
This component belongs to YIC's internal active GNSS antenna series designed for high-performance navigation. It addresses the need for accurate positioning in complex environments by combining multiple satellite systems. The ceramic construction ensures durability while maintaining consistent electrical performance across varying temperature conditions.
Direct substitutes include models like ATIGGBL52580-100 or ATIGGBL22580-100 from the same manufacturer. Verify compatibility regarding frequency coverage, connector interface, and amplifier specifications before substitution to ensure seamless integration without redesigning the host PCB layout.
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