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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ATMXT1066TD-C2U002 is a maXTouch TD Series touchscreen controller IC from Microchip Technology, designed for high-performance capacitive sensing. It features a unique charge-transfer acquisition engine supporting up to 41 X (transmit) and 26 Y (receive) lines, allocating a maximum of 1066 nodes for touch sensors. The device supports mutual and self-capacitance measurements, enabling robust multi-touch tracking with up to 16 concurrent touches. It operates within an industrial temperature range of -40°C to +85°C and utilizes a 114-ball UFBGA package measuring 7 × 5 × 0.65 mm with 0.5 mm pitch.
Verify the specific ordering suffix C2U002 corresponds to the 114-ball UFBGA High Density Interconnect package as defined in the product identification system. Confirm that the required firmware revision matches version 1.0.AA. Ensure design compliance with the industrial grade specifications (-40°C to +85°C), noting that this component is not suitable for automotive characterization. Check for RoHS compliance status in the latest datasheet before finalizing procurement.
Select the ATMXT1066TD-C2U002 when a 114-ball UFBGA package is required instead of the 117-ball variant. This part supports I2C interfaces including Standard, Fast, Fast-mode Plus, and High Speed modes, alongside SPI debug capabilities. Consider the power supply requirements: 3.3V nominal for digital/analog supplies and 1.8V to 3.3V for I/O. Evaluate if the 1066 node capacity aligns with the target screen size and electrode pitch, typically supporting up to 12.4-inch panels at 6.5 mm pitch.
This component belongs to the maXTouch TD Series, utilizing Microchip's patented capacitive sensing technology. The 'C2' package code denotes the 114-ball UFBGA form factor, while 'U' indicates the industrial temperature grade. It serves as a dedicated controller for complex touch interfaces, distinct from simpler key controllers or resistive touch solutions found in other Microchip portfolios.
The ATMXT1066TD-NHU001 is a compatible alternative offering identical functionality but housed in a 117-ball non-HDI UFBGA package. Designers must account for the pinout differences and physical footprint changes when substituting between the C2U and NHU package types. No functional upgrades are implied by the suffix change; only packaging and mechanical dimensions differ.