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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The ATMXT1066TD-C2UR002 is a maXTouch TD Series touchscreen controller IC from Microchip Technology, designed for high-performance capacitive sensing. It utilizes a charge-transfer acquisition engine to measure and track multiple finger touches with low latency. The device supports up to 41 X (transmit) lines and 26 Y (receive) lines, allocating a maximum of 1066 nodes for touch sensors. It operates within an industrial temperature range of -40°C to +85°C and features I2C and SPI interfaces. The component is housed in a 114-ball UFBGA package measuring 7 × 5 × 0.65 mm with a 0.5 mm pitch.
Verify the specific ordering suffix against the manufacturer's Product Identification System documentation. The 'R' suffix indicates tape and reel packaging, while 'U' denotes the industrial temperature grade (-40°C to +85°C). Confirm that the 114-ball UFBGA package dimensions and pinout match the target PCB layout requirements before finalizing procurement.
Select this controller for designs requiring up to 1066 touch nodes and support for both mutual and self-capacitance measurements. Ensure the host system provides the required digital supply voltages: 3.3V nominal for Vdd and AVdd, and 1.8V to 3.3V for VddIO. Consider the 114-ball UFBGA package constraints if space is limited, or evaluate the 117-ball variant if additional pins are needed for specific configurations.
This component belongs to the maXTouch TD Series, which employs patented capacitive sensing technology. The series is engineered for robust performance in noisy environments, featuring automatic touch sensor diagnostics and configurable test limits. It is distinct from automotive-qualified variants and is intended for general industrial and consumer electronics applications.
The ATMXT1066TD-NHU001 serves as a functional alternative utilizing a 117-ball UFBGA package instead of the 114-ball version. Both parts share identical core functionality and firmware compatibility but differ in physical footprint and pin allocation. Verify mechanical clearance and schematic adjustments when substituting between these package types.