ATSAM3N1CB-CU

Overview

The ATSAM3N1CB-CU is a 32-bit microcontroller based on the ARM Cortex-M3 core, operating at a maximum frequency of 48 MHz. It features 64 KB of in-system programmable flash memory and 8 KB of SRAM. The device includes an internal oscillator and supports a supply voltage range of 1.62 V to 3.6 V. Connectivity options include I2C, IrDA, SPI, and UART/USART interfaces. Peripherals encompass DMA, PWM, WDT, POR, and brown-out detection/reset circuits. The unit provides 79 general-purpose I/Os and integrates analog converters comprising sixteen 10-bit ADC channels and one 10-bit DAC. It is housed in a 100-TFBGA package with dimensions of 9x9 mm and operates within a temperature range of -40°C to 85°C.

Feature Summary

• Integrates an ARM Cortex-M3 processor core for efficient 32-bit execution
• Includes built-in analog-to-digital and digital-to-analog conversion capabilities
• Supports direct memory access for high-speed data transfer operations
• Features multiple serial communication interfaces including SPI and USART

Applications

• Industrial control systems requiring robust peripheral integration
• Consumer electronics utilizing low-voltage power supplies
• Medical devices needing precise analog signal processing
• Automotive instrumentation applications

Procurement Notes

Verify the specific suffix 'CU' against official Microchip documentation to confirm the exact package type and temperature grade, as suffixes define physical form factors. Ensure compatibility with existing board layouts regarding pin assignments and thermal requirements. Confirm that the selected variant meets all regulatory standards for the intended deployment environment before finalizing procurement orders.

Selection Notes

Select this component when a balance of moderate flash capacity and extensive I/O count is required within a compact footprint. Consider the 48 MHz clock speed sufficient for standard real-time control tasks without excessive power consumption. Evaluate the availability of the TFBGA package against assembly capabilities, as fine-pitch ball grid arrays require specialized surface mount technology processes compared to leaded packages.

Part Context

This part belongs to the SAM3N family of microcontrollers designed for cost-sensitive embedded applications. The series utilizes the ARM Cortex-M3 architecture to deliver performance while maintaining low power consumption. The SAM3N line typically offers various memory configurations and package options to suit different design constraints, positioning it as a versatile solution for general-purpose microcontroller needs in industrial and consumer sectors.

Replacement Considerations

Consult official substitution lists for compatible parts within the SAM3N family or newer generations like SAMD21 if architectural changes are acceptable. Verify pin-to-pin compatibility and software register mapping differences before implementing any alternative components in existing designs.