— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MCU 32BIT 128KB FLSH 100TFBGA
- Series:SAM3S
- Mfr:Microchip Technology
- Package:Tape & Reel (TR),Cut Tape (CT)
- Core Processor:ARM® Cortex®-M3
- Core Size:32-Bit Single-Core
- Speed:64MHz
- Connectivity:EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:79
- Program Memory Size:128KB (128K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:32K x 8
- Voltage - Supply (Vcc/Vdd):1.62V ~ 3.6V
- Data Converters:A/D 15x10/12b; D/A 2x12b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:100-TFBGA (9x9)
- Package / Case:100-TFBGA
Download product information
Overview
The ATSAM3S2CA-CUR is a 32-bit microcontroller from the Microchip SAM3S series, built on the ARM Cortex-M3 core. It features 128KB of in-system programmable Flash memory and 32KB of SRAM. The device operates at a maximum clock frequency of 64MHz with a supply voltage range of 1.62V to 3.6V. It is housed in a 100-pin TFBGA package and supports an industrial operating temperature range of -40°C to +85°C.
Feature Summary
- Integrates a high-performance 32-bit ARM Cortex-M3 processor for efficient code execution.
- Includes comprehensive peripheral sets such as USB, SPI, I2C, and multiple UARTs.
- Features internal oscillator and flexible power management options.
Applications
- Industrial control systems requiring robust processing capabilities
- Consumer electronics utilizing USB connectivity
- Medical devices needing precise analog-to-digital conversion
Procurement Notes
Verify the specific suffix CUR against official Microchip documentation to confirm the TFBGA-100 package and industrial temperature grade. Ensure compatibility with existing board layouts regarding pin assignments and thermal requirements before procurement.
Selection Notes
Select this component when a balance of moderate Flash capacity and extensive I/O is required within a compact footprint. Compare against other SAM3S variants based on specific memory needs and package constraints to ensure optimal fit for the design.
Part Context
This part belongs to the SAM3S family, which targets cost-sensitive applications demanding ARM Cortex-M3 performance. It shares architectural similarities with other SAM3S devices but differs in memory size and package type, serving as a mid-range solution within the portfolio.
Replacement Considerations
Consult official substitution guides for cross-referencing. Verify electrical and pinout compatibility with any alternative parts before implementation.
ChipApex | Global Electronic Components Supplier








