ATSAM3S4BA-MUR

Overview

The ATSAM3S4BA-MUR is a 32-bit microcontroller unit (MCU) from the Microchip SAM3S series, built on an ARM Cortex-M3 processor core. It operates at a maximum clock frequency of 64 MHz and features 256 KB of in-system programmable Flash memory alongside 48 KB of SRAM. The device provides 47 general-purpose I/O pins and supports multiple communication interfaces including USB, SPI, I2C, USART, SSC, and I2S. It integrates analog peripherals such as ten 12-bit ADC channels and two 12-bit DAC channels. Powered by a supply voltage ranging from 1.62 V to 3.6 V, it functions within an industrial temperature range of -40°C to +85°C and is housed in a compact 64-pin QFN package.

Feature Summary

• Integrates an ARM Cortex-M3 32-bit RISC processor core for efficient code execution.
• Includes high-speed USB OTG controller with full-speed PHY for data connectivity.
• Features integrated DMA controller to reduce CPU overhead during data transfers.
• Provides flexible analog conversion capabilities via multiple 12-bit ADC and DAC channels.

Applications

• USB peripheral devices requiring embedded control logic
• Industrial automation controllers with serial communication needs
• Consumer electronics utilizing audio or sensor interfaces
• Portable battery-powered equipment requiring low-power operation

Procurement Notes

Verify the specific suffix 'MUR' confirms the reel packaging format and industrial temperature grade (-40°C to +85°C). Ensure compatibility with the 64-pin QFN footprint during PCB layout. Confirm RoHS compliance status through official Microchip documentation prior to assembly. Cross-reference the latest datasheet revision to validate pinout assignments and electrical characteristics against current design requirements.

Selection Notes

Select this component when a balance of processing power and peripheral richness is required for cost-sensitive applications. The 256 KB Flash capacity suits complex firmware implementations without external memory. The inclusion of USB and multiple serial interfaces reduces bill-of-materials count. Consider the QFN package constraints for thermal management and soldering processes compared to LQFP alternatives.

Part Context

This MCU belongs to the SAM3S family, designed for high-performance, low-power applications using the ARM Cortex-M3 architecture. It serves as a mid-range solution within Microchip's portfolio, bridging the gap between basic 8/16-bit MCUs and higher-end Cortex-M4 devices. The series emphasizes ease of integration with standard development tools and extensive software support frameworks.

Replacement Considerations

ATSAM3S4BA-AU offers identical specifications but utilizes a 64-LQFP package instead of QFN. ATSAM3S4BA-MU provides the same functional performance in a QFN package but may differ in tape-and-reel quantity or specific manufacturing lot attributes. Verify pin-to-pin compatibility and thermal dissipation requirements when substituting.