ATSAM3S8CA-CU

Overview

The ATSAM3S8CA-CU is a 32-bit microcontroller from the Microchip SAM3S series, featuring an ARM Cortex-M3 core operating at 64MHz. It integrates 512KB of flash memory and 64KB of RAM within a 100-TFBGA (9x9) package. The device supports a supply voltage range of 1.62V to 3.6V and operates between -40°C and 85°C. Key peripherals include multiple communication interfaces such as USB, SPI, I2C, and USART, alongside analog converters with 15x10/12-bit ADC and 2x12-bit DAC capabilities.

Feature Summary

• Integrates an ARM Cortex-M3 processor core for efficient 32-bit execution
• Includes extensive connectivity options supporting USB, SPI, I2C, and UART protocols
• Features integrated analog-to-digital and digital-to-analog conversion units
• Supports direct memory access and pulse width modulation for peripheral control

Applications

• Industrial control systems requiring robust processing and connectivity
• Consumer electronics utilizing USB interfaces and high-resolution sensing
• Embedded applications needing reliable operation across wide temperature ranges

Procurement Notes

Verify the specific suffix CU indicates the 100-TFBGA package configuration during sourcing. Confirm that the component meets required environmental standards for the intended deployment zone. Ensure compatibility with existing board layouts regarding the TFBGA footprint dimensions. Cross-reference the manufacturer's latest documentation for any assembly or marking changes affecting this specific part number.

Selection Notes

Select this model when a balance of moderate flash capacity and rich peripheral sets is required in a compact surface-mount form factor. The internal oscillator simplifies clock circuit design compared to external crystal requirements. Consider the 100-pin count for sufficient I/O availability without moving to larger packages. Evaluate power consumption profiles against the 1.62V to 3.6V operating range for battery-sensitive designs.

Part Context

This component belongs to the SAM3S family, designed for cost-effective embedded solutions. It shares architectural similarities with other SAM3 variants but distinguishes itself through specific memory sizes and package options. The TFBGA packaging offers thermal efficiency and space savings suitable for dense PCB layouts. It serves as a mid-range option within the broader ARM-based microcontroller portfolio.

Replacement Considerations

ATSAM3S8CA-AU provides identical electrical specifications in a 100-LQFP package for leaded mounting needs. ATSAM3S8CA-UR offers the same functionality in a tape-and-reel format for automated assembly processes. Verify pinout compatibility and mechanical dimensions before substituting different package types.