ATSAM3SD8CA-CU

ATSAM3SD8CA-CU

$6.83
  • Description:IC MCU 32BIT 512KB FLSH 100TFBGA
  • Series:SAM3S
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:ARM® Cortex®-M3

SKU:2fd09f90500d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MCU 32BIT 512KB FLSH 100TFBGA
  • Series:SAM3S
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:ARM® Cortex®-M3
  • Core Size:32-Bit Single-Core
  • Speed:64MHz
  • Connectivity:EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
  • Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O:79
  • Program Memory Size:512KB (512K x 8)
  • Program Memory Type:FLASH
  • EEPROM Size:-
  • RAM Size:64K x 8
  • Voltage - Supply (Vcc/Vdd):1.62V ~ 3.6V
  • Data Converters:A/D 15x10/12b; D/A 2x12b
  • Oscillator Type:Internal
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:100-TFBGA (9x9)
  • Package / Case:100-TFBGA

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ATSAM3SD8CA-CU

Overview

The ATSAM3SD8CA-CU is a 32-bit microcontroller from the Microchip SAM3S series, featuring an ARM Cortex-M3 core operating at up to 64MHz. It integrates 512KB of Flash memory and 64KB of SRAM within a 100-pin TFBGA package. The device supports a supply voltage range of 1.62V to 3.6V and includes integrated USB capabilities alongside standard communication interfaces.

Feature Summary

  • Integrates ARM Cortex-M3 processor with hardware floating-point unit support for efficient digital signal processing.
  • Includes dedicated USB Full-Speed controller with on-chip transceiver for direct host or peripheral connectivity.
  • Features high-speed parallel external memory interface (EBI) supporting NAND flash, SRAM, and NOR flash expansion.

Applications

  • USB-enabled consumer electronics and peripherals
  • Industrial control systems requiring external memory expansion
  • Data logging devices with high storage capacity requirements

Procurement Notes

Verify the specific suffix 'CU' indicates the 100-TFBGA(9x9) package variant distinct from LQFP versions. Confirm assembly site changes via recent PCNs as manufacturing locations may shift. Ensure EMI shielding requirements are met for the BGA footprint in final PCB layout designs.

Selection Notes

Select this model when USB connectivity and large external memory access are required simultaneously. Compare against ATSAM3S8CA variants if USB functionality is unnecessary to reduce cost. Verify that the TFBGA package size fits the available board space constraints compared to QFP alternatives.

Part Context

This component belongs to the SAM3S family, designed for applications needing robust performance with moderate power consumption. It shares architectural similarities with the SAM3U series but adds specific external bus capabilities. The part serves as a bridge between simple MCUs and complex application processors.

Replacement Considerations

  • ATSAM3S8CA-CU
  • ATSAM3SD8CA-AU

ATSAM3SD8CA-CUATSAM3SD8CA-CU
$6.83
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