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Product Detailed Parameters
- Description:IC MCU 32BIT 512KB FLSH 100TFBGA
- Series:SAM3X
- Mfr:Microchip Technology
- Package:Tray
- Core Processor:ARM® Cortex®-M3
- Core Size:32-Bit Single-Core
- Speed:84MHz
- Connectivity:CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:63
- Program Memory Size:512KB (512K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:96K x 8
- Voltage - Supply (Vcc/Vdd):1.62V ~ 3.6V
- Data Converters:A/D 16x12b; D/A 2x12b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:100-TFBGA (9x9)
- Package / Case:100-TFBGA
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Overview
The ATSAM3X8CA-CU is a 32-bit ARM Cortex-M3 microcontroller from the SAM3X series, operating at up to 84 MHz. It features 512 Kbytes of Flash memory and 96 Kbytes of SRAM. The device includes an Ethernet MAC, dual CAN controllers, and a High-Speed USB Mini Host/Device port with embedded transceiver. It offers up to 103 I/O lines, a 12-bit ADC, and a 12-bit DAC. Operating voltage ranges from 1.62V to 3.6V, with an industrial temperature range of -40°C to +85°C.
Feature Summary
- Integrated Ethernet MAC and dual CAN controllers for robust networking connectivity
- High-speed data transfer capabilities supported by multi-layer bus matrix and DMA channels
- Capacitive touch readiness via QTouch library support for user interface implementation
- Low-power operation with Sleep, Wait, and Backup modes
Applications
- Industrial automation gateways
- Home and building automation systems
- Smart grid networking applications
Procurement Notes
Verify package type (TFBGA-100) and suffix 'CU' against official Microchip documentation to ensure correct variant selection. Confirm RoHS compliance status and lead time requirements directly with authorized distributors or the manufacturer prior to ordering.
Selection Notes
Select this component for designs requiring integrated Ethernet and CAN interfaces alongside high-performance processing. Ensure power supply sequencing meets VDDIO and VDDCORE constraints. Verify peripheral availability matches specific application needs, as pin counts vary between 100 and 144-pin packages.
Part Context
Part of the SAM3X/A family based on the ARM Cortex-M3 core. Designed for high-throughput applications requiring multiple communication interfaces. Shares architectural similarities with SAM3A series but differs in specific peripheral configurations and package options.
Replacement Considerations
ATSAM3X8EA-CU: Similar specifications but in LFBGA-144 package. ATSAM3X8CA-AU: Same specifications but in LQFP-100 package.
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