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Product Detailed Parameters
- Description:IC MCU 32BIT 256KB FLSH 100TFBGA
- Series:SAM4S
- Mfr:Microchip Technology
- Package:Tray
- Core Processor:ARM® Cortex®-M4
- Core Size:32-Bit Single-Core
- Speed:120MHz
- Connectivity:EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Number of I/O:79
- Program Memory Size:256KB (256K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:64K x 8
- Voltage - Supply (Vcc/Vdd):1.62V ~ 3.6V
- Data Converters:A/D 16x12b; D/A 2x12b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:100-TFBGA (9x9)
- Package / Case:100-TFBGA
- Grade:-
- Qualification:-
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Overview
The ATSAM4S4CB-CN is a 32-bit microcontroller from the Microchip SAM4S series, featuring an ARM Cortex-M4 core operating at 120MHz. It integrates 256KB of flash memory and 64KB of SRAM within a 100-TFBGA package. The device supports a supply voltage range of 1.62V to 3.6V and operates between -40°C and 105°C. Key peripherals include USB, SPI, I2C, UART/USART, SSC, IrDA, SD/MMC card interfaces, EBI/EMI, DMA, PWM, WDT, POR, and brown-out detection/reset circuits.
Feature Summary
- Integrates ARM Cortex-M4 processor with single-cycle multiply and hardware divide for efficient signal processing.
- Includes multiple communication interfaces such as USB Full-Speed, SPI, I2C, USART, and SSC for versatile connectivity.
- Features external bus interface (EBI/EMI) to support expansion with external memory or peripheral devices.
- Provides analog conversion capabilities with multiple 12-bit ADC channels and two 12-bit DAC channels.
Applications
- Industrial control systems requiring robust communication protocols
- Medical equipment utilizing precise analog-to-digital conversion
- Consumer electronics with USB connectivity requirements
- Automotive applications needing extended temperature operation ranges
Procurement Notes
Verify the specific suffix CN indicates the commercial/industrial temperature range and TFBGA packaging configuration. Confirm RoHS compliance status through official Microchip documentation prior to integration. Ensure design compatibility with the 100-pin TFBGA footprint and thermal management requirements for the specified operating environment.
Selection Notes
Select this component when a balance of moderate flash capacity and extensive peripheral connectivity is required. The 100-TFBGA package suits high-density PCB layouts. Consider alternative packages like LQFP if lead-free soldering constraints differ. Evaluate power consumption profiles against application needs, noting the internal oscillator options.
Part Context
This part belongs to the SAM4S family, designed for cost-sensitive applications demanding Cortex-M4 performance. It shares architectural similarities with other SAM4S variants but differs in memory size and package type. The series emphasizes low power consumption while maintaining high processing throughput for embedded control tasks.
Replacement Considerations
ATSAM4S4CA-CU offers similar specifications in a 100-TFBGA package. ATSAM4S4BB-AN provides equivalent functionality in a 64-LQFP package. Verify pinout compatibility and software library support before substituting with these alternatives.
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