ATSAM4SD16CB-ANR

Overview

The ATSAM4SD16CB-ANR is a 32-bit microcontroller from the Microchip SAM4S series, built on the ARM Cortex-M4 core. It operates at a maximum frequency of 120 MHz and integrates 1MB (1M x 8) of embedded Flash memory with 160KB (160K x 8) of SRAM. The device features a 100-TFBGA package and supports a supply voltage range of 1.62V to 3.6V. It includes 16-channel 12-bit ADCs, two 12-bit DACs, and extensive connectivity options such as USB, SPI, I2C, and USART. The component is rated for an operating temperature range of -40°C to 105°C.

Feature Summary

• Integrates an ARM Cortex-M4 processor with DSP instruction set and Memory Protection Unit
• Supports high-speed data conversion via multiple 12-bit analog-to-digital and digital-to-analog converters
• Includes full-speed USB 2.0 device interface with on-chip transceiver
• Features dual-bank Flash memory architecture with optional cache for enhanced code execution

Applications

• Industrial control systems requiring robust processing and safety features
• Smart metering applications utilizing internal calibration and low-power modes
• USB-enabled peripheral devices and communication interfaces
• Medical equipment demanding precise analog signal acquisition

Procurement Notes

Verify the specific suffix 'ANR' against official Microchip documentation to confirm tape-and-reel packaging status, as standard datasheets may list bulk or tray variants. Ensure the part number matches the exact pinout and temperature grade required for your design. Cross-reference with the latest errata sheet for known silicon revisions. Confirm RoHS compliance status directly with the manufacturer's current product announcements.

Selection Notes

Select this component when a balance of high-performance computing and extensive analog peripherals is required within a compact TFBGA footprint. The 120 MHz Cortex-M4 core provides sufficient throughput for complex algorithms, while the integrated USB and DMA channels reduce CPU load. Consider the 160KB SRAM size relative to application stack requirements. Evaluate the thermal performance of the TFBGA package for the intended enclosure environment.

Part Context

This device belongs to the SAM4S family, which offers pin-to-pin compatibility with SAM3N and SAM3S products in 100-pin configurations. It shares architectural similarities with the SAM4C series but focuses on single-core efficiency. The SAM4S series is designed for cost-sensitive applications needing ARM Cortex-M4 capabilities without the complexity of dual-core architectures found in higher-end models.

Replacement Considerations

ATSAM4SD16CA-AU: Offers identical core specifications and memory sizes but utilizes a 100-LQFP package instead of TFBGA. Verify pin compatibility if swapping packages. ATSAM4SD16CB-CN: Same electrical and functional profile but uses a different package variant; ensure mechanical fitment aligns with the PCB layout.