— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MCU 32BIT 64KB FLASH 32QFN
- Series:SAM DA1, Functional Safety (FuSa)
- Mfr:Microchip Technology
- Package:Tape & Reel (TR),Cut Tape (CT)
- Core Processor:ARM® Cortex®-M0+
- Core Size:32-Bit Single-Core
- Speed:48MHz
- Connectivity:I2C, SCI, SPI, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:26
- Program Memory Size:64KB (64K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:8K x 8
- Voltage - Supply (Vcc/Vdd):2.7V ~ 3.63V
- Data Converters:A/D 10x12b; D/A 1x10b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount, Wettable Flank
- Supplier Device Package:32-VQFN (5x5)
- Package / Case:32-VFQFN Exposed Pad
- Grade:-
- Qualification:-
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Overview
The ATSAMDA1E16B-MBT is a System in Package (SiP) microcontroller from Microchip Technology, integrating an ARM Cortex-M0+ core with automotive-grade qualification. It features 16 kB of Flash memory and 2 kB of SRAM, operating at a maximum clock frequency of 48 MHz. The device supports a supply voltage range of 2.7 V to 3.63 V and includes a 12-bit ADC with 14 channels and a 10-bit DAC. Packaged in a 48-VQFN, it operates within a temperature range of -40°C to +105°C.
Feature Summary
- Automotive functional safety qualification compliant with AEC-Q100 standards
- Integrated LIN transceiver for direct bus connectivity
- On-chip voltage regulator for stable internal power management
Applications
- Automotive body control modules
- LIN network node implementation
- Sensor interface units requiring integrated regulation
Procurement Notes
Verify the specific suffix against official Microchip documentation to confirm package type and temperature grade. Ensure compatibility with automotive environmental requirements before integration. Cross-reference the datasheet for pinout definitions and electrical characteristics relevant to the specific SiP configuration.
Selection Notes
Select this component when a compact solution combining MCU processing with physical layer communication is required. The integrated LIN transceiver reduces external component count compared to standard MCU variants. Verify that the 16 kB program memory meets application firmware size constraints.
Part Context
This part belongs to the SAM DA1 family, designed specifically for automotive applications requiring functional safety. It extends the capabilities of standard SAM D series MCUs by incorporating additional analog and communication peripherals suitable for vehicle networks.
Replacement Considerations
Consult Microchip documentation for qualified alternatives within the SAM DA1 or SAM HA1 families. Direct substitutes must match the 48-VQFN package and automotive qualification status.
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