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ATSAME70N20B-CN
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Product Detailed Parameters
- Description：IC MCU 32BIT 1MB FLASH 100TFBGA
- Series：SAM E70
- Mfr：Microchip Technology
- Package：Tray
- Core Processor：ARM® Cortex®-M7
- Core Size：32-Bit Single-Core
- Speed：300MHz
- Connectivity：CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
- Peripherals：Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O：75
- Program Memory Size：1MB (1M x 8)
- Program Memory Type：FLASH
- EEPROM Size：-
- RAM Size：384K x 8
- Voltage - Supply (Vcc/Vdd)：1.62V ~ 3.6V
- Data Converters：A/D 10x12b; D/A 2x12b
- Oscillator Type：Internal
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：100-TFBGA (9x9)
- Package / Case：100-TFBGA
- Grade：-
- Qualification：-
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Overview
The ATSAME70N20B-CN is a 32-bit microcontroller from the Microchip SAM E70 series, featuring an ARM Cortex-M7 core operating at up to 300 MHz. It integrates 1 MB of flash memory and 384 KB of SRAM within a 144-pin LFBGA package. The device supports a supply voltage range of 1.62 V to 3.6 V and includes multiple communication interfaces such as Ethernet, USB, CANbus, I2C, SPI, and UART. It also provides 10-channel 12-bit ADCs and two 12-bit DACs for analog applications.
Feature Summary
- High-performance processing via ARM Cortex-M7 core with DSP instructions
- Integrated Ethernet MAC with dedicated DMA for network connectivity
- Flexible memory architecture combining large flash and SRAM capacities
- Comprehensive peripheral set including multiple serial controllers and timers
Applications
- Industrial automation and control systems
- Smart metering and utility infrastructure
- Medical equipment requiring high-speed data processing
- Automotive infotainment and instrument clusters
Procurement Notes
Verify the specific suffix CN against official Microchip documentation to confirm package type and temperature grade. Ensure compatibility with existing PCB footprints for the LFBGA-144 configuration. Cross-reference pin assignments with the latest datasheet to avoid interface mismatches during integration.
Selection Notes
Select this component when a balance of high computational power and extensive connectivity is required. The 300 MHz speed suits complex algorithm execution, while the integrated Ethernet and USB peripherals reduce external component count. Consider thermal management requirements due to the high-frequency operation in the BGA package.
Part Context
This part belongs to the SAM E70 family, designed for applications demanding robust performance and rich connectivity. It shares architectural similarities with other Cortex-M7 devices but offers specific memory and peripheral configurations tailored for industrial and commercial embedded solutions.
Replacement Considerations
Direct substitutes include ATSAME70N20A-AN or ATSAMS70N20A-ANT, provided package and suffix variations are accounted for. Verify functional equivalence regarding peripheral availability and electrical characteristics before substitution.
