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Product Detailed Parameters
- Description:IC MCU 32BIT 512KB FLASH 144LQFP
- Series:SAM E70
- Mfr:Microchip Technology
- Package:Tray
- Core Processor:ARM® Cortex®-M7
- Core Size:32-Bit Single-Core
- Speed:300MHz
- Connectivity:CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
- Peripherals:Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:114
- Program Memory Size:512KB (512K x 8)
- Program Memory Type:FLASH
- EEPROM Size:-
- RAM Size:256K x 8
- Voltage - Supply (Vcc/Vdd):1.7V ~ 3.6V
- Data Converters:A/D 24x12b; D/A 2x12b
- Oscillator Type:Internal
- Operating Temperature:-40°C ~ 105°C (TA)
- Mounting Type:Surface Mount
- Supplier Device Package:144-LQFP (20x20)
- Package / Case:144-LQFP
- Grade:-
- Qualification:-
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Overview
The ATSAME70Q19B-AN is a 32-bit microcontroller from the SAM E70 series, featuring an ARM Cortex-M7 core operating at 300MHz. It integrates 512KB of flash memory and 256KB of SRAM within a 144-LQFP package. The device supports a supply voltage range of 1.7V to 3.6V and includes extensive connectivity options such as Ethernet MAC, USB HS, CAN-FD, I2C, SPI, and UART. It also provides analog peripherals including multiple 12-bit ADCs and DACs.
Feature Summary
- High-performance ARM Cortex-M7 processor with hardware floating-point unit for advanced DSP capabilities
- Integrated 10/100 Mbps Ethernet MAC with Audio Video Bridging (AVB) support
- Flexible memory architecture with configurable tightly coupled memory and multi-port SRAM
- Comprehensive set of communication interfaces including USB High-Speed and CAN-FD
Applications
- Industrial automation controllers requiring deterministic networking
- Audio and video processing systems utilizing AVB protocols
- Smart energy metering and utility infrastructure devices
- Medical equipment with high-speed data acquisition needs
Procurement Notes
Verify the specific suffix 'AN' corresponds to the 144-LQFP package variant when sourcing. Confirm RoHS compliance status and moisture sensitivity level requirements against your assembly process standards. Ensure the ordering quantity aligns with manufacturer tray specifications. Cross-reference the latest datasheet revision to confirm pinout and electrical characteristics match your design intent before finalizing procurement.
Selection Notes
Select this component when a balance of high computational power and rich peripheral integration is required in a moderate pin-count package. It is suitable for applications needing Ethernet connectivity without external PHYs. Consider alternative packages like LFBGA if higher I/O counts or smaller footprints are necessary. Evaluate thermal performance under load given the 300MHz operation frequency.
Part Context
This part belongs to the Microchip SAM E70 family, designed for high-performance embedded applications. It shares the core architecture with other variants in the series but differs in memory size, package type, and specific peripheral configurations. The E70 series targets markets demanding robust connectivity and real-time processing capabilities.
Replacement Considerations
Direct substitutes include other SAM E70 variants with similar memory and package constraints, such as ATSAME70Q19A-AN. Verify pin compatibility and peripheral availability before swapping. No cross-family replacements are recommended due to architectural differences.
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